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 Preliminary Technical Data
SUMMARY
SHARC Processor ADSP-21462W/ADSP-21465W/ADSP-21467
Code compatible with all other members of the SHARC family The ADSP-21462W/ADSP-21465W/ADSP-21467 are available with unique audiocentric peripherals such as the digital applications interface, DTCP (digital transmission content protection protocol), serial ports, precision clock generators, S/PDIF transceiver, asynchronous sample rate converters, input data port, and more. For complete ordering information, see Automotive Products on Page 59 and Ordering Guide on Page 59.
Note: This datasheet is preliminary. This document contains material that is subject to change without notice. High performance 32-bit/40-bit floating point processor optimized for high performance audio processing Single-instruction, multiple-data (SIMD) computational architecture On-chip memory--5 Mbits of on-chip RAM, 4 Mbits of on-chip ROM Automotive applications--the ADSP-21462W and the ADSP21465W are available exclusively as automotive products
CORE PROCESSOR
PLL THERMAL DIODE TIMER INSTRUCTION CACHE 32 x 48-BIT
4 BLOCKS OF ON-CHIP MEMORY
5M BIT RAM 4M BIT ROM
JTAG TEST & EMULATION
EXTERNAL PORT
8
DATA FLAGS PWM
DAG1 8 x 4 x 32
DAG2 8 x 4 x 32
PROGRAM SEQUENCER
ADDR 32
DATA 48
ASYNCHRONOUS MEMORY INTERFACE (AMI)
24
ADDRESS 3 7 AMI CONTROL DDR2 CONTROL DATA ADDRESS
PM ADDRESS BUS DM ADDRESS BUS
32 32 PM DATA BUS 64
DDR2 DRAM CONTROLLER
16 19
DM DATA BUS
64
IOA(19)
IOD(32) ACCELERATORS
FFT FIR IIR
PROCESSING ELEMENT (PEX)
PROCESSING ELEMENT (PEY)
PX REGISTER
IOP REGISTER CONTROL STATUS, & DATA BUFFERS
DMA ARBITER
MLB LINK PORTS 20
3/5
4
DAI ROUTING UNIT
PRECISION CLOCK GENERATORS (4)
SERIAL PORTS (8) INPUT DATA PORT/ PDAP ASRC
TWO WIRE INTERFACE GPIO DPI PINS (14)
DPI ROUTING UNIT
GPIO IRQ/FLAGS
SPI PORT (2)
UART DTCP GP TIMERS (2)
S
S/PDIF (RX/TX)
DAI PINS (20)
DIGITAL APPLICATIONS INTERFACE
20
DIGITAL PERIPHERAL INTERFACE
14
I/O PROCESSOR
Figure 1. Functional Block Diagram
SHARC and the SHARC logo are registered trademarks of Analog Devices, Inc.
Rev. PrA
Information furnished by Analog Devices is believed to be accurate and reliable. However, no responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other rights of third parties that may result from its use. Specifications subject to change without notice. No license is granted by implication or otherwise under any patent or patent rights of Analog Devices. Trademarks and registered trademarks are the property of their respective companies.
One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106 U.S.A. Tel: 781.329.4700 www.analog.com Fax: 781.326.3113 (c)2008 Analog Devices, Inc. All rights reserved.
ADSP-21462W/ADSP-21465W/ADSP-21467
KEY FEATURES--PROCESSOR CORE
At up to 450 MHz core instruction rate, the processor performs at 2.7 GFLOPS/900 MMACs 5 Mbits on-chip RAM, 4 Mbits on-chip ROM for simultaneous access by the core processor and DMA DDR2 DRAM interface (16-bit) operating at maximum frequency of half the core clock frequency Dual data address generators (DAGs) with modulo and bitreverse addressing Zero-overhead looping with single-cycle loop setup, providing efficient program sequencing VISA (variable instruction set) execution support Single instruction multiple data (SIMD) architecture provides: Two computational processing elements Concurrent execution Code compatibility with other SHARC family members at the assembly level Parallelism in buses and computational units allows: Single cycle executions (with or without SIMD) of a multiply operation, an ALU operation, a dual memory read or write, and an instruction fetch Transfers between memory and core at a sustained 7.2 Gbytes/second bandwidth FFT accelerator implements radix-2 complex/real input, complex output FFT with no core intervention IIR accelerators perform dedicated IIR filtering with high-performance, fixed- and floating-point processing capabilities with no core intervention FIR accelerators perform dedicated FIR filtering with highperformance, fixed- and floating-point processing capabilities with no core intervention Program sequencer can execute code directly from external memory bank 0 (SRAM, as well as DDR2 DRAM). This allows more options to a user in terms of code storage. New opcodes of 16 and 32 bits are supported in addition to the existing 48 bit opcodes. Variable Instruction Set Architecture (VISA) execution from external DDR2 DRAM memory is also supported.
Preliminary Technical Data
Delay-line DMA engine maintains circular buffers in external memory with tap/offset based reads 16-bit data access for synchronous DDR2 DRAM memory 8-bit data access for asynchronous memory 4 memory select lines allows multiple external memory devices Digital audio interface (DAI) includes eight serial ports, four precision clock generators, an input data port, an S/PDIF transceiver, and a signal routing unit Digital peripheral interface (DPI) includes, two timers, one UART, and two SPI ports, a DTCP cipher (ADSP-21462W and ADSP-21465W), and a two-wire interface port Outputs of PCG A and B can be routed through DAI pins Outputs of PCG C and D can be driven on to DAI as well as DPI pins Eight dual data line serial ports -- each has a clock, frame sync, and two data lines that can be configured as either a receiver or transmitter pair TDM support for telecommunications interfaces including 128 TDM channel support for newer telephony interfaces such as H.100/H.110 Up to 16 TDM stream support, each with 128 channels per frame Companding selection on a per channel basis in TDM mode Input data port (IDP), configurable as eight channels of serial data or seven channels of serial data and up to a 20-bit wide parallel data channel Signal routing unit provides configurable and flexible connections between the various peripherals and the DAI/DPI components 4 independent asynchronous sample rate converters (ASRC). Each converter has separate serial input and output ports, a de-emphasis filter providing up to -128 dB SNR performance, stereo sample rate converter and supports leftjustified, I2S, TDM, and right-justified modes and 24-, 20-, 18-, and 16-audio data word lengths. An MLB (media local bus) interface allows the processor to support for both 3-pin as well as 5-pin media local bus protocols (ADSP-21462W and ADSP-21465W). 2 muxed flag/IRQ lines 1 muxed flag/IRQ /AMI_MS pin 1 muxed flag/Timer expired line /AMI_MS pin S/PDIF-compatible digital audio receiver/transmitter supports EIAJ CP-340 (CP-1201), IEC-958, AES/EBU standards Left-justified, I2S or right-justified serial data input with 16-, 18-, 20- or 24-bit word widths (transmitter) Pulse-width modulation provides: 16 PWM outputs configured as four groups of four outputs supports center-aligned or edge-aligned PWM waveforms PLL has a wide variety of software and hardware multiplier/divider ratios Thermal diode to monitor die temperature Available in 19 mm by 19 mm PBGA package (see Ordering Guide on Page 59)
INPUT/OUTPUT FEATURES
Two 8-bit wide link ports can connect to the link ports of other SHARCs or peripherals. Link ports are bidirectional programmable ports having eight data lines, an acknowledge line and a clock line DMA controller supports 67 DMA channels for transfers between internal memory and a variety of peripherals DMA transfers at peripheral clock speed, in parallel with full-speed processor execution External port provides glueless connection to 16-bit wide synchronous DDR2 DRAM using a dedicated DDR2 DRAM controller, and 8-bit wide asynchronous memory devices using asynchronous memory interface (AMI) Programmable wait state options (for AMI) 2 to 31 DDR2_CLK cycles
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Preliminary Technical Data
TABLE OF CONTENTS
Summary ............................................................... 1 Key Features--Processor Core ................................. 2 Input/Output Features ........................................... 2 Table Of Contents .................................................... 3 Revision History ...................................................... 3 General Description ................................................. 4 Family Core Architecture ....................................... 5 Memory ............................................................. 6 External Memory .................................................. 6 Input/Output Features ........................................... 8 System Design ..................................................... 11 Development Tools .............................................. 12 Additional Information ......................................... 12 Pin Function Descriptions ........................................ 13 Data Modes ........................................................ 17 Boot Modes ........................................................ 17 Core Instruction Rate to CLKIN Ratio Modes ............. 17 Specifications ......................................................... 18 Operating Conditions ........................................... 18 Electrical Characteristics ........................................ 19 Maximum Power Dissipation ................................. 20 Absolute Maximum Ratings ................................... 20 ESD Sensitivity .................................................... 20 Timing Specifications ........................................... 21 Output Drive Currents .......................................... 53 Test Conditions ................................................... 53 Capacitive Loading ............................................... 53 Thermal Characteristics ........................................ 54 Ball configuration - ADSP-2146x ............................. 55 PBGA Pinout ......................................................... 56 Outline Dimensions ................................................ 58 Automotive Products ............................................... 59 Ordering Guide ...................................................... 59
ADSP-21462W/ADSP-21465W/ADSP-21467
REVISION HISTORY
11/08--Revision PrA Initial version
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ADSP-21462W/ADSP-21465W/ADSP-21467
GENERAL DESCRIPTION
The ADSP-21462W/ADSP-21465W/ADSP-21467 SHARC(R) processors are members of the SIMD SHARC family of DSPs that feature Analog Devices' Super Harvard Architecture. The processors are source code compatible with the ADSP-2126x, ADSP-2136x, ADSP-2137x, and ADSP-2116x DSPs as well as with first generation ADSP-2106x SHARC processors in SISD (single-instruction, single-data) mode. These new processors are 32-bit/40-bit floating point processors optimized for high performance audio applications with its large on-chip SRAM, multiple internal buses to eliminate I/O bottlenecks, and an innovative digital applications interface (DAI). Table 1. SHARC Family Features
ADSP-21462W ADSP-21465W ADSP-21467
Preliminary Technical Data
Table 1. SHARC Family Features (Continued)
ADSP-21462W ADSP-21465W ADSP-21467 Yes 2 Yes 324-ball PBGA 128 dB Speed (at 450 MHz) 20.44 s 1.11 ns 4.43 ns 10.0 ns 17.78 ns 6.67 ns 10.0 ns
Feature AMI interface with 8-bit support SPI TWI Package SRC Performance
1
Yes 2 Yes 324-ball PBGA 128 dB
Yes 2 Yes 324-ball PBGA 128 dB
Feature Frequency RAM ROM1 Audio Decoders in ROM Pulse-Width Modulation S/PDIF DTCP2 DDR2 Memory Interface DDR2 Memory Bus Width Direct DMA from SPORTs to external memory FIR accelerator IIR accelerator FFT accelerator MLB Interface IDP Serial Ports SRU DDR2 Memory Interface UART DAI and DPI Link ports S/PDIF transceiver
400 MHz 5M bits 4M bits No Yes Yes Yes 1/2 CCLK Max 16 bits Yes Yes Yes Yes Yes Yes 8 2 Yes 1 20/14 pins 2 1
400 MHz 5M bits 4M bits Yes Yes Yes Yes 1/2 CCLK Max 16 bits Yes Yes Yes Yes Yes Yes 8 2 Yes 1 20/14 pins 2 1
450 MHz 5M bits 4M bits Yes Yes Yes No 1/2 CCLK Max 16 bits Yes Yes Yes Yes No Yes 8 2 Yes 1 20/14 pins 2 1
Audio decoding algorithms include PCM, Dolby Digital EX, Dolby Prologic IIx, DTS 96/24, Neo:6, DTS ES, MPEG-2 AAC, MP3, and functions like bass management, delay, speaker equalization, graphic equalization, and more. Decoder/post-processor algorithm combination support varies depending upon the chip version and the system configurations. Please visit www.analog.com for complete information. 2 The ADSP-21462W and ADSP-21465W processors provide the Digital Transmission Content Protection protocol, a proprietary security protocol. Contact your Analog Devices sales office for more information.
As shown in the functional block diagram on Page 1, the processor uses two computational units to deliver a significant performance increase over the previous SHARC processors on a range of DSP algorithms. Fabricated in a state-of-the-art, high speed, CMOS process, the processor achieves an instruction cycle time of 2.22 ns at 450 MHz (ADSP-21467) and 2.5 ns at 400 MHz (ADSP-21462W, ADSP-21465W). With its SIMD computational hardware, the processors can perform 2.7 GFLOPS running at 450 MHz (ADSP-21467) and 2.4 GFLOPS running at 400 MHz (ADSP-21462W, ADSP-21465W). Table 2 shows performance benchmarks for the ADSP-2146x processors. Table 2. Processor Benchmarks
Benchmark Algorithm 1024 Point Complex FFT (Radix 4, With Reversal) FIR Filter (per Tap)1 IIR Filter (per Biquad)1 Matrix Multiply (Pipelined) [3 x 3] x [3 x 1] [4 x 4] x [4 x 1] Divide (y/x) Inverse Square Root
1
Assumes two files in multichannel SIMD mode
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Preliminary Technical Data
The ADSP-21462W/ADSP-21465W/ADSP-21467 continues SHARC's industry-leading standards of integration for DSPs, combining a high performance 32-bit DSP core with integrated, on-chip system features. The block diagram on Page 1 illustrates the following architectural features: * Two processing elements, each of which comprises an ALU, multiplier, shifter, and data register file * Data address generators (DAG1, DAG2) * Program sequencer with instruction cache * PM and DM buses capable of supporting four 32-bit data transfers between memory and the core at every core processor cycle * Two programmable interval timers with external event counter capabilities * On-chip SRAM * JTAG test access port * FFT, FIR, IIR accelerators The block diagram of the processor on Page 1 also illustrates the following architectural features: * DMA controller * Digital applications interface that includes four precision clock generators (PCG), an S/PDIF-compatible digital audio receiver/transmitter with four independent asynchronous sample rate converters, an input data port (IDP) with eight serial ports, DTCP cipher, eight serial interfaces, a 20-bit parallel input port (PDAP), and a flexible signal routing unit (DAI SRU). * Digital peripheral interface that includes two timers, one UART, two serial peripheral interfaces (SPI), a 2-wire interface (TWI), and a flexible signal routing unit (DPI SRU).
ADSP-21462W/ADSP-21465W/ADSP-21467
tion is executed in both processing elements, but each processing element operates on different data. This architecture is efficient at executing math intensive DSP algorithms. Entering SIMD mode also has an effect on the way data is transferred between memory and the processing elements. When in SIMD mode, twice the data bandwidth is required to sustain computational operation in the processing elements. Because of this requirement, entering SIMD mode also doubles the bandwidth between memory and the processing elements. When using the DAGs to transfer data in SIMD mode, two data values are transferred with each access of memory or the register file.
Independent, Parallel Computation Units
Within each processing element is a set of computational units. The computational units consist of an arithmetic/logic unit (ALU), multiplier, and shifter. These units perform all operations in a single cycle. The three units within each processing element are arranged in parallel, maximizing computational throughput. Single multifunction instructions execute parallel ALU and multiplier operations. In SIMD mode, the parallel ALU and multiplier operations occur in both processing elements. These computation units support IEEE 32-bit singleprecision floating-point, 40-bit extended precision floatingpoint, and 32-bit fixed-point data formats.
Data Register File
A general-purpose data register file is contained in each processing element. The register files transfer data between the computation units and the data buses, and store intermediate results. These 10-port, 32-register (16 primary, 16 secondary) register files, combined with the processor's enhanced Harvard architecture, allow unconstrained data flow between computation units and internal memory. The registers in PEX are referred to as R0-R15 and in PEY as S0-S15.
Single-Cycle Fetch of Instruction and Four Operands
The ADSP-21462W/ADSP-21465W/ADSP-21467 features an enhanced Harvard architecture in which the data memory (DM) bus transfers data and the program memory (PM) bus transfers both instructions and data (see Figure 1 on page 1). With the its separate program and data memory buses and onchip instruction cache, the processor can simultaneously fetch four operands (two over each data bus) and one instruction (from the cache), all in a single cycle.
FAMILY CORE ARCHITECTURE
The ADSP-21462W/ADSP-21465W/ADSP-21467 is code compatible at the assembly level with the ADSP-2137x, ADSP2136x, ADSP-2126x, ADSP-21160, and ADSP-21161, and with the first generation ADSP-2106x SHARC processors. The ADSP-21462W/ADSP-21465W/ADSP-21467 shares architectural features with the ADSP-2126x, ADSP-2136x, ADSP2137x, and ADSP-2116x SIMD SHARC processors, as detailed in the following sections.
Instruction Cache
The ADSP-21462W/ADSP-21465W/ADSP-21467 includes an on-chip instruction cache that enables three-bus operation for fetching an instruction and four data values. The cache is selective--only the instructions whose fetches conflict with PM bus
SIMD Computational Engine
The ADSP-21462W/ADSP-21465W/ADSP-21467 contains two computational processing elements that operate as a singleinstruction, multiple-data (SIMD) engine. The processing elements are referred to as PEX and PEY and each contains an ALU, multiplier, shifter, and register file. PEX is always active, and PEY may be enabled by setting the PEYEN mode bit in the MODE1 register. When this mode is enabled, the same instruc-
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ADSP-21462W/ADSP-21465W/ADSP-21467
data accesses are cached. This cache allows full speed execution of core, looped operations such as digital filter multiply-accumulates, and FFT butterfly processing.
Preliminary Technical Data
MEMORY
The ADSP-21462W/ADSP-21465W/ADSP-21467 adds the following architectural features to the SIMD SHARC family core.
Data Address Generators With Zero-Overhead Hardware Circular Buffer Support
The ADSP-21462W/ADSP-21465W/ADSP-21467's two data address generators (DAGs) are used for indirect addressing and implementing circular data buffers in hardware. Circular buffers allow efficient programming of delay lines and other data structures required in digital signal processing, and are commonly used in digital filters and Fourier transforms. The two DAGs of the processors contain sufficient registers to allow the creation of up to 32 circular buffers (16 primary register sets, 16 secondary). The DAGs automatically handle address pointer wraparound, reduce overhead, increase performance, and simplify implementation. Circular buffers can start and end at any memory location.
On-Chip Memory
The processors contain 5 Mbits of internal RAM. Each block can be configured for different combinations of code and data storage (see Table 3 on Page 7). Each memory block supports single-cycle, independent accesses by the core processor and I/O processor. The ADSP-21462W/ADSP-21465W/ADSP-21467 memory architecture, in combination with its separate on-chip buses, allow two data transfers from the core and one from the I/O processor, in a single cycle. The processor's SRAM can be configured as a maximum of 160k words of 32-bit data, 320k words of 16-bit data, 106.7k words of 48-bit instructions (or 40-bit data), or combinations of different word sizes up to 5 megabit. All of the memory can be accessed as 16-bit, 32-bit, 48-bit, or 64-bit words. A 16-bit floating-point storage format is supported that effectively doubles the amount of data that may be stored on-chip. Conversion between the 32-bit floating-point and 16-bit floating-point formats is performed in a single instruction. While each memory block can store combinations of code and data, accesses are most efficient when one block stores data using the DM bus for transfers, and the other block stores instructions and data using the PM bus for transfers. Using the DM bus and PM buses, with one bus dedicated to a memory block, assures single-cycle execution with two data transfers. In this case, the instruction must be available in the cache. The memory map in Table 3 displays the internal memory address space of the ADSP-21462W/ADSP-21465W/ADSP21467. The 48-bit space section describes what this address range looks like to an instruction that retrieves 48-bit memory. The 32-bit section describes what this address range looks like to an instruction that retrieves 32-bit memory.
Flexible Instruction Set
The 48-bit instruction word accommodates a variety of parallel operations, for concise programming. For example, the ADSP-21462W/ADSP-21465W/ADSP-21467 can conditionally execute a multiply, an add, and a subtract in both processing elements while branching and fetching up to four 32-bit values from memory--all in a single instruction.
Variable Instruction Set Architecture
In addition to supporting the standard 48-bit instructions from previously existing SHARC family of processors, the ADSP21462W/ADSP-21465W/ADSP-21467 support new instructions of 16 and 32 bits in addition to the existing 48 bit instructions. This feature, called Variable Instruction Set Architecture (VISA), is based on dropping redundant/unused bits within the 48-bit instruction to create more efficient and compact code. The program sequencer will now support fetching these 16-bit and 32-bit instructions as well in addition to the standard 48-bit instructions, both from internal as well as external memory. Source modules will need to be built using the VISA option, in order to allow code generation tools to create these more efficient opcodes.
EXTERNAL MEMORY
The external port on the ADSP-21462W/ADSP21465W/ADSP-21467 SHARC provides a high performance, glueless interface to a wide variety of industry-standard memory devices. The external port may be used to interface to synchronous and/or asynchronous memory devices through the use of its separate internal DDR2 memory controller. The 16-bit DDR2 DRAM controller connects to industry-standard synchronous DRAM devices, while the second 8-bit asynchronous memory controller is intended to interface to a variety of memory devices. Four memory select pins enable up to four separate devices to coexist, supporting any desired combination of synchronous and asynchronous device types. Non DDR2 DRAM external memory address space is shown in Table 4.
FFT Accelerator
FFT accelerator implements radix-2 complex/real input, complex output FFT with no core intervention.
FIR Accelerators
The FIR (finite impulse response) accelerator consists of a 1024 word coefficient memory, a 1024 word deep delay line for the data, and four MAC units. A controller manages the accelerator. The FIR accelerator runs at the peripheral clock frequency.
IIR Accelerators
The IIR (infinite impulse response) accelerator consists of a 1440 word coefficient memory for storage of biquad coefficients, a data memory for storing the intermediate data and one MAC unit. A controller manages the accelerator. The IIR accelerator runs at the peripheral clock frequency.
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Preliminary Technical Data
External Memory Execution
In the ADSP-21462W/ADSP-21465W/ADSP-21467, the program sequencer can execute code directly from external memory bank 0 (SRAM, as well as DDR2 DRAM). This allows more options to a user in terms of code and data storage. With external execution, programs run at slower speeds since 48-bit
ADSP-21462W/ADSP-21465W/ADSP-21467
instructions are fetched in parts from a 16-bit external bus coupled with the inherent latency of fetching instructions from DDR2 DRAM. VISA mode and SIMD mode accesses are supported for DDR2 space. However, external memory execution from DDR2 space is different for VISA and non-VISA mode.
Table 3. ADSP-21462W/ADSP-21465W/ADSP-21467 Internal Memory Space
IOP Registers 0x0000 0000-0x0003 FFFF Long Word (64 bits) BLOCK 0 ROM 0x0004 0000-0x0004 7FFF Reserved 0x0004 8000-0x0004 8FFF BLOCK 0 RAM 0x0004 9000-0x0004 EFFF Reserved 0x0004 F000-0x0004 FFFF BLOCK 1 ROM 0x0005 0000-0x0005 7FFF Reserved 0x0005 8000-0x0005 8FFF BLOCK 1 RAM 0x0005 9000-0x0005 EFFF Reserved 0x0005 F000-0x0005 FFFF BLOCK 2 RAM 0x0006 0000-0x0006 3FFF Reserved 0x0006 4000-0x0006 FFFF BLOCK 3 RAM 0x0007 0000-0x0007 3FFF Reserved 0x0007 4000-0x0007 FFFF Extended Precision Normal or Instruction Word (48 bits) BLOCK 0 ROM 0x0008 0000-0x0008 AAA9 Reserved 0x0009 0000-0x0009 1FFF BLOCK 0 RAM 0x0008 C000-0x0009 3FFF Reserved 0x0009 E000-0x0009 FFFF BLOCK 1 ROM 0x000A 0000-0x000A AAA9 Reserved 0x000B 000-0x000B 1FFF BLOCK 1 RAM 0x000A C000-0x000B 3FFF Reserved 0x000B E000-0x000B FFFF BLOCK 2 RAM 0x000C 0000-0x000C 5554 Reserved 0x000C 8000-0x000D FFFF BLOCK 3 RAM 0x000E 0000-0x000E 5554 Reserved 0x000E 8000-0x000F FFFF Normal Word (32 bits) BLOCK 0 ROM 0x0008 0000-0x0008 FFFF Reserved 0x0009 0000-0x0009 1FFF BLOCK 0 RAM 0x0009 2000-0x0009 DFFF Reserved 0x0009 E000-0x0009 FFFF BLOCK 1 ROM 0x000A 0000-0x000A FFFF Reserved 0x000B 0000-0x000B 1FFF BLOCK 1 RAM 0x000B 2000-0x000B DFFF Reserved 0x000B E000-0x000B FFFF BLOCK 2 RAM 0x000C 0000-0x000C 7FFF Reserved 0x000C 8000-0x000D FFFF BLOCK 3 RAM 0x000E 0000-0x000E 7FFF Reserved 0x000E 8000-0x000F FFFF Short Word (16 bits) BLOCK 0 ROM 0x0010 0000-0x0011 FFFF Reserved 0x0012 0000-0x0012 3FFF BLOCK 0 RAM 0x0012 4000-0x0013 BFFF Reserved 0x0013 C000-0x0013 FFFF BLOCK 1 ROM 0x0014 0000-0x0015 FFFF Reserved 0x0016 0000-0x0016 3FFF BLOCK 1 RAM 0x0016 4000-0x0017 BFFF Reserved 0x0017 C000-0x0017 FFFF BLOCK 2 RAM 0x0018 0000-0x0018 FFFF Reserved 0x0019 0000-0x001B FFFF BLOCK 3 RAM 0x001C 0000-0x001C FFFF Reserved 0x001D 0000-0x001F FFFF
DDR2 Support
The ADSP-21462W/ADSP-21465W/ADSP-21467 supports a 16-bit DDR2 interface operating at a maximum frequency of half the core clock. Execution from external memory is supported. External memory devices up to 2 Gbits in size can be supported. Delay line DMA functionality supported.
DDR2_CS0), and can be configured to contain between 32M bytes and 256M bytes of memory. DDR2 DRAM external memory address space is shown in Table 5 A set of programmable timing parameters is available to configure the DDR2 DRAM banks to support memory devices.
DDR2 DRAM Controller
The DDR2 DRAM controller provides an 16-bit interface to up to four separate banks of industry-standard DDR2 DRAM devices. Fully compliant with the DDR2 DRAM standard, each bank can has its own memory select line (DDR2_CS3-
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ADSP-21462W/ADSP-21465W/ADSP-21467
Table 5. External Memory for DDR2 DRAM Addresses
Size in Words 62M 64M 64M 64M
Preliminary Technical Data
Shared External Memory
The ADSP-21462W/ADSP-21465W/ADSP-21467 processor supports connecting to common shared external DDR2 memory with other ADSP-2146x processors to create shared external bus processor systems. This support includes: * Distributed, on-chip arbitration for the shared external bus * Fixed and rotating priority bus arbitration * Bus time-out logic * Bus lock Multiple processors can share the external bus with no additional arbitration logic. Arbitration logic is included on-chip to allow the connection of up to TBD processors. Bus arbitration is accomplished through the BR6-1 signals and the priority scheme for bus arbitration is determined by the setting of the RPBA pin. Table 6 on Page 13 provides descriptions of the pins used in multiprocessor systems.
Bank Bank 0 Bank 1 Bank 2 Bank 3
Address Range 0x0020 0000 - 0x03FF FFFF 0x0400 0000 - 0x07FF FFFF 0x0800 0000 - 0x0BFF FFFF 0x0C00 0000 - 0x0FFF FFFF
Table 4. External Memory for Non DDR2 DRAM Addresses
Size in Words 14M 16M 16M 16M
Bank Bank 0 Bank 1 Bank 2 Bank 3
Address Range 0x0020 0000 - 0x00FF FFFF 0x0400 0000 - 0x04FF FFFF 0x0800 0000 - 0x08FF FFFF 0x0C00 0000 - 0x0CFF FFFF
INPUT/OUTPUT FEATURES
The ADSP-21462W and ADSP-21465W I/O processors provide 67 channels of DMA, while ADSP-21467 I/O processors provide 36 channels of DMA as well as an extensive set of peripherals. These include a 20 lead digital applications interface, which controls: * Eight serial ports * S/PDIF receiver/transmitter * Four precision clock generators * Input data port/parallel data acquisition port * Four asynchronous sample rate converters The ADSP-21462W/ADSP-21465W/ADSP-21467 processor also contains a 14 lead digital peripheral interface, which controls: * Two general-purpose timers * Two serial peripheral interfaces * One universal asynchronous receiver/transmitter (UART) * An I2C(R)-compatible 2-wire interface * Two PCGs (C and D) can also be routed through DPI
Note that the external memory bank addresses shown are for normal-word (32-bit) accesses. If 48-bit instructions as well as 32-bit data are both placed in the same external memory bank, care must be taken while mapping them to avoid overlap. In case of 32-bit wide external memory, two 48-bit instructions will be stored in three 32-bit wide memory locations. For example, if 2k instructions are placed in 32-bit wide external memory starting at the bank 0 normal-word base address 0x0030 0000 (corresponding to instruction address 0x0020 0000) and ending at address 0x0030 0BFF (corresponding to instruction address 0x0020 07FF), then data buffers can be placed starting at an address that is offset by 3k 32-bit words (for example, starting at 0x0030 0C00).
Asynchronous Memory Controller
The asynchronous memory controller provides a configurable interface for up to four separate banks of memory or I/O devices. Each bank can be independently programmed with different timing parameters, enabling connection to a wide variety of memory devices including SRAM, flash, and EPROM, as well as I/O devices that interface with standard memory control lines. Bank 0 occupies a 14M word window and banks 1, 2, and 3 occupy a 16M word window in the processor's address space but, if not fully populated, these windows are not made contiguous by the memory controller logic. The asynchronous memory controller is capable of a maximum throughput of TBD Mbps using a TBD MHz external bus speed. Other features include 8 to 32-bit packing and unpacking, booting from bank select 1, and support for delay line DMA.
DMA Controller
The processor's on-chip DMA controller allows data transfers without processor intervention. The DMA controller operates independently and invisibly to the processor core, allowing DMA operations to occur while the core is simultaneously executing its program instructions. DMA transfers can occur between the ADSP-21462W/ADSP-21465W/ADSP-21467's internal memory and its serial ports, the SPI-compatible (serial peripheral interface) ports, the IDP (input data port), the parallel data acquisition port (PDAP) or the UART. Sixty-seven channels of DMA are available on the ADSP-21462W and ADSP-21465W devices, and thirty-six channels on the ADSP-21467. The breakdown is as follows: 16 via the serial ports, eight via the input data port, two for the
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Preliminary Technical Data
UART, two for the SPI interface, two for the external port, two for DTCP (or memory-to-memory data transfer when DTCP is not used), two for the link port, two for the FFT/FIR/IIR accelerators, and up to 31 DMA channels for the media local bus interface on the ADSP-21462W and ADSP-21465W. Programs can be downloaded to the ADSP-21462W/ADSP21465W/ADSP-21467 using DMA transfers. Other DMA features include interrupt generation upon completion of DMA transfers, and DMA chaining for automatic linked DMA transfers. Delay Line DMA The ADSP-21462W/ADSP-21465W/ADSP-21467 processor provides delay line DMA functionality. This allows processor reads and writes to external delay line buffers (and hence to external memory) with limited core interaction. Scatter/Gather DMA The ADSP-21462W/ADSP-21465W/ADSP-21467 processor provides scatter/gather DMA functionality. This allows processor DMA reads/writes to/from non-contingeous memory blocks.
ADSP-21462W/ADSP-21465W/ADSP-21467
The serial ports operate at a maximum data rate of 56.25 Mbps. Serial port data can be automatically transferred to and from on-chip memory/external memory via dedicated DMA channels. Each of the serial ports can work in conjunction with another serial port to provide TDM support. One SPORT provides two transmit signals while the other SPORT provides the two receive signals. The frame sync and clock are shared. Serial ports operate in five modes: * Standard DSP serial mode * Multichannel (TDM) mode * I2S mode * Packed I2S mode * Left-justified sample pair mode Left-justified sample pair mode is a mode where in each frame sync cycle two samples of data are transmitted/received--one sample on the high segment of the frame sync, the other on the low segment of the frame sync. Programs have control over various attributes of this mode. Each of the serial ports supports the left-justified sample pair and I2S protocols (I2S is an industry-standard interface commonly used by audio codecs, ADCs, and DACs such as the Analog Devices AD183x family), with two data pins, allowing four left-justified sample pair or I2S channels (using two stereo devices) per serial port, with a maximum of up to 32 I2S channels. The serial ports permit little-endian or big-endian transmission formats and word lengths selectable from 3 bits to 32 bits. For the left-justified sample pair and I2S modes, dataword lengths are selectable between 8 bits and 32 bits. Serial ports offer selectable synchronization and transmit modes as well as optional -law or A-law companding selection on a per channel basis. Serial port clocks and frame syncs can be internally or externally generated. The serial ports also contain frame sync error detection logic where the serial ports detect frame syncs that arrive early (for example frame syncs that arrive while the transmission/reception of the previous word is occurring). All the serial ports also share one dedicated error interrupt.
Digital Applications Interface (DAI)
The digital applications interface (DAI) provides the ability to connect various peripherals to any of the DAI pins (DAI_P20-1). Programs make these connections using the signal routing unit (SRU), shown in Figure 1. The SRU is a matrix routing unit (or group of multiplexers) that enables the peripherals provided by the DAI to be interconnected under software control. This allows easy use of the DAI associated peripherals for a much wider variety of applications by using a larger set of algorithms than is possible with nonconfigurable signal paths. The DAI also includes eight serial ports, four precision clock generators (PCG), S/PDIF transceiver, four ASRCs, and an input data port (IDP). The IDP provides an additional input path to the SHARC core, configurable as either eight channels of serial data, or a single 20-bit wide synchronous parallel data acquisition port. Each data channel has its own DMA channel that is independent from the processor's serial ports.
S/PDIF-Compatible Digital Audio Receiver/Transmitter and Synchronous/Asynchronous Sample Rate Converter
The S/PDIF receiver/transmitter has no separate DMA channels. It receives audio data in serial format and converts it into a biphase encoded signal. The serial data input to the receiver/transmitter can be formatted as left justified, I2S or right justified with word widths of 16, 18, 20, or 24 bits. The serial data, clock, and frame sync inputs to the S/PDIF receiver/transmitter are routed through the signal routing unit (SRU). They can come from a variety of sources such as the SPORTs, external pins, the precision clock generators (PCGs), and are controlled by the SRU control registers. The sample rate converter (ASRC) contains four ASRC blocks and is the same core as that used in the AD1896 192 kHz stereo asynchronous sample rate converter and provides up to 128 dB SNR. The ASRC block is used to perform synchronous or asyn-
Serial Ports
The ADSP-21462W/ADSP-21465W/ADSP-21467 features eight synchronous serial ports that provide an inexpensive interface to a wide variety of digital and mixed-signal peripheral devices such as Analog Devices' AD183x family of audio codecs, ADCs, and DACs. The serial ports are made up of two data lines, a clock, and frame sync. The data lines can be programmed to either transmit or receive and each data line has a dedicated DMA channel. Serial ports can support up to 16 transmit or 16 receive channels of audio data when all eight SPORTs are enabled, or four full duplex TDM streams of 128 channels per frame.
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chronous sample rate conversion across independent stereo channels, without using internal processor resources. The four SRC blocks can also be configured to operate together to convert multichannel audio data without phase mismatches. Finally, the ASRC can be used to clean up audio data from jittery clock sources such as the S/PDIF receiver.
Preliminary Technical Data
* DMA (direct memory access) - The DMA controller transfers both transmit and receive data. This reduces the number and frequency of interrupts required to transfer data to and from memory. The UART has two dedicated DMA channels, one for transmit and one for receive. These DMA channels have lower default priority than most DMA channels because of their relatively low service rates. The UART port's baud rate, serial data format, error code generation and status, and interrupts are programmable: * Supporting bit rates ranging from (fPCLK/ 1,048,576) to (fPCLK/16) bits per second. * Supporting data formats from 7 to 12 bits per frame. * Both transmit and receive operations can be configured to generate maskable interrupts to the processor. In conjunction with the general-purpose timer functions, autobaud detection is supported.
Digital Transmission Content Protection
The DTCP specification defines a cryptographic protocol for protecting audio entertainment content from illegal copying, intercepting, and tampering as it traverses high performance digital buses, such as the IEEE 1394 standard. Only legitimate entertainment content delivered to a source device via another approved copy protection system (such as the DVD content scrambling system) will be protected by this copy protection system. This feature is available on the ADSP-21462W and ADSP-21465W processors only. Licensing through DTLA is required for these products. Visit www.dtcp.com for more information.
Timers
The ADSP-21462W/ADSP-21465W/ADSP-21467 has a total of three timers: a core timer that can generate periodic software interrupts and two general purpose timers that can generate periodic interrupts and be independently set to operate in one of three modes: * Pulse waveform generation mode * Pulse width count/capture mode * External event watchdog mode The core timer can be configured to use FLAG3 as a timer expired signal, and each general-purpose timer has one bidirectional pin and four registers that implement its mode of operation: a 6-bit configuration register, a 32-bit count register, a 32-bit period register, and a 32-bit pulse width register. A single control and status register enables or disables both generalpurpose timers independently.
Digital Peripheral Interface (DPI)
The digital peripheral interface provides connections to two serial peripheral interface ports (SPI), one universal asynchronous receiver-transmitter (UART), 12 flags, a 2-wire interface (TWI), and two general-purpose timers.
Serial Peripheral (Compatible) Interface
The ADSP-2146x SHARC processors contain two serial peripheral interface ports (SPIs). The SPI is an industry-standard synchronous serial link, enabling the SPI-compatible port to communicate with other SPI compatible devices. The SPI consists of two data pins, one device select pin, and one clock pin. It is a full-duplex synchronous serial interface, supporting both master and slave modes. The SPI port can operate in a multimaster environment by interfacing with up to four other SPIcompatible devices, either acting as a master or slave device. The SPI-compatible peripheral implementation also features programmable baud rate and clock phase and polarities. The SPIcompatible port uses open drain drivers to support a multimaster configuration and to avoid data contention.
2-Wire Interface Port (TWI)
The TWI is a bidirectional 2-wire, serial bus used to move 8-bit data while maintaining compliance with the I2C bus protocol. The TWI master incorporates the following features: * 7-bit addressing * Simultaneous master and slave operation on multiple device systems with support for multi master data arbitration * Digital filtering and timed event processing * 100 kbps and 400 kbps data rates * Low interrupt rate
UART Port
The processors provide a full-duplex Universal Asynchronous Receiver/Transmitter (UART) port, which is fully compatible with PC-standard UARTs. The UART port provides a simplified UART interface to other peripherals or hosts, supporting full-duplex, DMA-supported, asynchronous transfers of serial data. The UART also has multiprocessor communication capability using 9-bit address detection. This allows it to be used in multidrop networks through the RS-485 data interface standard. The UART port also includes support for 5 to 8 data bits, 1 or 2 stop bits, and none, even, or odd parity. The UART port supports two modes of operation: * PIO (programmed I/O) - The processor sends or receives data by writing or reading I/O-mapped UART registers. The data is double-buffered on both transmit and receive.
Pulse-Width Modulation
The PWM module is a flexible, programmable, PWM waveform generator that can be programmed to generate the required switching patterns for various applications related to motor and engine control or audio power control. The PWM generator can generate either center-aligned or edge-aligned PWM waveforms. In addition, it can generate complementary signals on
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Preliminary Technical Data
two outputs in paired mode or independent signals in nonpaired mode (applicable to a single group of four PWM waveforms). The entire PWM module has four groups of four PWM outputs each. Therefore, this module generates 16 PWM outputs in total. Each PWM group produces two pairs of PWM signals on the four PWM outputs. The PWM generator is capable of operating in two distinct modes while generating center-aligned PWM waveforms: single update mode or double update mode. In single update mode the duty cycle values are programmable only once per PWM period. This results in PWM patterns that are symmetrical about the mid-point of the PWM period. In double update mode, a second updating of the PWM registers is implemented at the midpoint of the PWM period. In this mode, it is possible to produce asymmetrical PWM patterns that produce lower harmonic distortion in three-phase PWM inverters.
ADSP-21462W/ADSP-21465W/ADSP-21467
The "Running Reset" feature allows a user to perform a reset of the processor core and peripherals, but without resetting the PLL and DDR2 DRAM controller, or performing a Boot. The functionality of the CLKOUT/RESETOUT/RUNRSTIN pin has now been extended to also act as the input for initiating a Running Reset. For more information, see the ADSP-2146x SHARC Processor Hardware Reference.
Power Supplies
The processors have separate power supply connections for the internal (VDD_INT), external (VDD_EXT), and analog (VDD_A/VSS_A) power supplies. The internal and analog supplies must meet the VDD_INT specifications. The external supply must meet the VDD_EXT specification. All external supply pins must be connected to the same power supply. Note that the analog supply pin (VDD_A) powers the processor's internal clock generator PLL. To produce a stable clock, it is recommended that PCB designs use an external filter circuit for the VDD_A pin. Place the filter components as close as possible to the VDD_A/VSS_A pins. For an example circuit, see Figure 2. (A recommended ferrite chip is the muRata BLM18AG102SN1D).
Link Ports
Two 8-bit wide link ports can connect to the link ports of other DSPs or peripherals. Link ports are bidirectional ports having eight data lines, an acknowledge line and a clock line. Link ports can operate at a maximum frequency of 166 MHz.
MediaLB
The ADSP-21462W and ADSP-21465W have an MLB interface which allows the processor to function as a media local bus device. It includes support for both 3-pin as well as 5-pin media local bus protocols. It supports speeds up to 1024 FS (49.25 Mbits/sec, FS = 48.1 kHz) and up to 31 logical channels, with up to 124 bytes of data per media local bus frame.
100nF VDDINT
10nF
1nF
ADSP-213xx AVDD
HI Z FERRITE BEAD CHIP
AVSS
LOCATE ALL COMPONENTS CLOSE TO AVDD AND AVSS PINS
ROM Based Security
The ADSP-21462W/ADSP-21465W/ADSP-21467 has a ROM security feature that provides hardware support for securing user software code by preventing unauthorized reading from the internal code when enabled. When using this feature, the processor does not boot-load any external code, executing exclusively from internal SRAM/ROM. Additionally, the processor is not freely accessible via the JTAG port. Instead, a unique 64-bit key, which must be scanned in through the JTAG or Test Access Port will be assigned to each customer. The device will ignore a wrong key. Emulation features and external boot modes are only available after the correct key is scanned.
Figure 2. Analog Power (VDD_A) Filter Circuit
To reduce noise coupling, the PCB should use a parallel pair of power and ground planes for VDD_INT and VSS. Use wide traces to connect the bypass capacitors to the analog power (VDD_A) and ground (VSS_A) pins. Note that the VDD_A and VSS_A pins specified in Figure 2 are inputs to the processor and not the analog ground plane on the board--the VSS_A pin should connect directly to digital ground (VSS) at the chip
Target Board JTAG Emulator Connector
Analog Devices DSP Tools product line of JTAG emulators uses the IEEE 1149.1 JTAG test access port of the ADSP-2146x processors to monitor and control the target board processor during emulation. Analog Devices DSP Tools product line of JTAG emulators provides emulation at full processor speed, allowing inspection and modification of memory, registers, and processor stacks. The processor's JTAG interface ensures that the emulator will not affect target system loading or timing. For complete information on Analog Devices' SHARC DSP Tools product line of JTAG emulator operation, see the appropriate "Emulator Hardware User's Guide".
SYSTEM DESIGN
The following sections provide an introduction to system design options and power supply issues.
Program Booting
The internal memory of the ADSP-2146x boots at system power-up from an 8-bit EPROM via the external port, link port, an SPI master, or an SPI slave. Booting is determined by the boot configuration (BOOTCFG2-0) pins (see Table 8 on Page 17).
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DEVELOPMENT TOOLS
The ADSP-21462W/ADSP-21465W/ADSP-21467 processors are supported with a complete set of CROSSCORE(R) software and hardware development tools, including Analog Devices emulators and VisualDSP++(R) development environment. The same emulator hardware that supports other SHARC processors also fully emulates the ADSP-2146x processors.
Preliminary Technical Data
Evaluation Kit
Analog Devices offers a range of EZ-KIT Lite(R) evaluation platforms to use as a cost effective method to learn more about developing or prototyping applications with Analog Devices processors, platforms, and software tools. Each EZ-KIT Lite includes an evaluation board along with an evaluation suite of the VisualDSP++(R) development and debugging environment with the C/C++ compiler, assembler, and linker. Also included are sample application programs, power supply, and a USB cable. All evaluation versions of the software tools are limited for use only with the EZ-KIT Lite product. The USB controller on the EZ-KIT Lite board connects the board to the USB port of the user's PC, enabling the VisualDSP++ evaluation suite to emulate the on-board processor in-circuit. This permits the customer to download, execute, and debug programs for the EZ-KIT Lite system. It also allows in-circuit programming of the on-board Flash device to store user-specific boot code, enabling the board to run as a standalone unit without being connected to the PC. With a full version of VisualDSP++ installed (sold separately), engineers can develop software for the EZ-KIT Lite or any custom defined system. Connecting one of Analog Devices JTAG emulators to the EZ-KIT Lite board enables high speed, nonintrusive emulation.
EZ-KIT Lite Evaluation Board
For evaluation of the processors, use the EZ-KIT Lite(R) board being developed by Analog Devices. The board comes with onchip emulation capabilities and is equipped to enable software development. Multiple daughter cards are available.
Designing an Emulator-Compatible DSP Board (Target)
The Analog Devices family of emulators are tools that every DSP developer needs to test and debug hardware and software systems. Analog Devices has supplied an IEEE 1149.1 JTAG Test Access Port (TAP) on each JTAG DSP. Nonintrusive incircuit emulation is assured by the use of the processor's JTAG interface--the emulator does not affect target system loading or timing. The emulator uses the TAP to access the internal features of the processor, allowing the developer to load code, set breakpoints, observe variables, observe memory, and examine registers. The processor must be halted to send data and commands, but once an operation has been completed by the emulator, the DSP system is set running at full speed with no impact on system timing. To use these emulators, the target board must include a header that connects the DSP's JTAG port to the emulator. For details on target board design issues including mechanical layout, single processor connections, signal buffering, signal termination, and emulator pod logic, see the EE-68: Analog Devices JTAG Emulation Technical Reference on the Analog Devices website (www.analog.com)--use site search on "EE-68." This document is updated regularly to keep pace with improvements to emulator support.
ADDITIONAL INFORMATION
This data sheet provides a general overview of the ADSP-2146x architecture and functionality. For detailed information on the ADSP-21462W/ADSP-21465W/ADSP-21467 family core architecture and instruction set, refer to the ADSP-2136x/ADSP2146x SHARC Processor Programming Reference.
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Preliminary Technical Data
PIN FUNCTION DESCRIPTIONS
The following symbols appear in the Type column of Table 6: A = asynchronous, I = input, O = output, S = synchronous, (A/D) = active drive, (O/D) = open drain, and T = three-state, (pd) = pull-down resistor, (pu) = pull-up resistor. Table 6. Pin List
State During and After LVTTL SSTL18 Reset High-Z/ driven low (boot)
ADSP-21462W/ADSP-21465W/ADSP-21467
Name AMI_ADDR23-0
Type I/O/T
AMI_DATA7-0
I/O/T
High-Z
DAI _P20-1
I/O with fixed weak pull-up on input path 1, 2
High-Z
DPI _P14-1
I/O with fixed weak pull-up only on input path1, 2
High-Z
AMI_ACK
I (pu)
O/T AMI_RD O/T AMI_WR DDR2_ADDR15-0 DDR2_BA2-0 O/T O/T
High-Z
High-Z
High-Z/ Driven low High-Z/ DDR2 Bank Address Input pins. Define which bank an ACTIVATE, Driven low READ, WRITE, or PRECHARGE command is being applied. BA2-0 define which mode register including MR, EMR, EMR(2), and EMR(3) is loaded during the LOAD MODE command.
Description External Address. The ADSP-21462W/ADSP-21465W/ADSP-21467 outputs addresses for external memory and peripherals on these pins. The data pins can be multiplexed to support the PDAP (I) and PWM (O). After reset, all AMI_ADDR23-0 pins are in EMIF mode and FLAG(0-3) pins will be in FLAGS mode (default). When configured in the IDP_PDAP_CTL register, IDP channel 0 scans the AMI_ADDR23-0 pins for parallel input data. External Data. The data pins can be multiplexed to support the external memory interface data (I/O), the PDAP (I), FLAGS (I/O) and PWM (O). After reset, all AMI_DATA pins are in EMIF mode and FLAG(0-3) pins will be in FLAGS mode (default). Digital Applications Interface Pins. These pins provide the physical interface to the DAI SRU. The DAI SRU configuration registers define the combination of on-chip audiocentric peripheral inputs or outputs connected to the pin and to the pin's output enable. The configuration registers of these peripherals then determine the exact behavior of the pin. Any input or output signal present in the DAI SRU may be routed to any of these pins. The DAI SRU provides the connection from the serial ports, the S/PDIF module, input data ports (2), and the precision clock generators (4), to the DAI_P20-1 pins. Digital Peripheral Interface. These pins provide the physical interface to the DPI SRU. The DPI SRU configuration registers define the combination of onchip peripheral inputs or outputs connected to the pin and to the pin's output enable. The configuration registers of these peripherals then determines the exact behavior of the pin. Any input or output signal present in the DPI SRU may be routed to any of these pins. The DPI SRU provides the connection from the timers (2), SPIs (2), UART (1), flags (12), and general-purpose I/O (9) to the DPI_P14-1 pins. Memory Acknowledge (AMI_ACK). External devices can deassert AMI_ACK (low) to add wait states to an external memory access. AMI_ACK is used by I/O devices, memory controllers, or other peripherals to hold off completion of an external memory access. AMI Port Read Enable. AMI_RD is asserted whenever the ADSP21462W/ADSP-21465W/ADSP-21467 reads a word from external memory. AMI_RD has fixed internal pull-up resistor1, 2. External Port Write Enable. AMI_WR is asserted when the ADSP21462W/ADSP-21465W/ADSP-21467 writes a word to external memory. AMI_WR has fixed internal pull-up resistor1, 2. DDR2 Address pins. DDR2 address pins.
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Table 6. Pin List (Continued)
State During and After LVTTL SSTL18 Reset High-Z/ Driven high High-Z/ Driven low High-Z/ Driven high High-Z High-Z/ Driven high High-Z
Preliminary Technical Data
Name DDR2_CAS DDR2_CKE
Type O/T
O/T O/T
DDR2_CS3-0 DDR2_DATA15-0 DDR2_DM1-0 I/O/T O/T
DDR2_DQS1-0 DDR2_DQS1-0 DDR2_RAS DDR2_WE
I/O/T (Differential) O/T
O/T
DDR2_CLK0, DDR2_CLK0, DDR2_CLK1, DDR2_CLK1 DDR2_ODT AMI_MS0-1
O/T (Differential)
High-Z/ Driven high High-Z/ DDR2 Write Enable. Connect to DDR2_WE pin, in conjunction with other Driven DDR2 command pins, defines the operation for the DDR2 to perform high High-Z/ DDR2 Clock. Free running, minimum frequency not guaranteed during reset. driven low
Description DDR2 Column Address Strobe. Connect to DDR2_CAS pin, in conjunction with other DDR2 command pins, defines the operation for the DDR2 to perform. DDR2 Clock Enable Output to DDR2. Active high signal. Connect to DDR2 CKE signal. DDR2 Chip Select. All commands are masked when DDR2_CS3-0 is driven high. DDR2_CS3-0 are decoded emory address lines. Each DDR2_CS3-0lines select the corresponding bank. DDR2 Data In/Out. Connect to corresponding DDR2_DATA pins. DDR2 Input Data Mask. Mask for the DDR2 write data if driven high. Sampled on both edges of DDR2_DQS at DDR2 side. DM0 corresponds to DDR2_DATA 7-0 and DM1 corresponds to DDR2_DATA 15-8. Data Strobe. Output with Write Data. Input with Read Data. DQS0 corresponds to DDR2_DATA 7-0 and DQS1 corresponds to DDR2_DATA 15-8. DDR2 Row Address Strobe. Connect to DDR2_RAS pin, in conjunction with other DDR2 command pins, defines the operation for the DDR2 to perform.
O/T O/T
FLAG[0]/IRQ0 FLAG[1]/IRQ1 FLAG[2]/IRQ2/ AMI_MS2 FLAG[3]/TIMEX P/ AMI_MS3 LDAT07-0 LDAT17-0 LCLK0 LCLK1 LACK0 LACK1 THD_P THD_M
I/O I/O I/O I/O I/0 I/O I/O I O
High-Z/ DDR2 On Die Termination. ODT pin when driven high (along with other Driven low requirements) enables the DDR2 termination resistances. High-Z Memory Select Lines 0-1. These lines are asserted (low) as chip selects for the corresponding banks of external memory on the AMI interface. The MS10 lines are decoded memory address lines that change at the same time as the other address lines. When no external memory access is occurring the MS1-0 lines are inactive; they are active however when a conditional memory access instruction is executed, whether or not the condition is true. The MS1 pin can be used in EPORT/FLASH boot mode. For more information, see the ADSP-2146x SHARC Processor Hardware Reference. High-Z FLAG0/Interrupt Request0. High-Z FLAG1/Interrupt Request1. High-Z FLAG2/Interrupt Request2/Async Memory Select2. High-Z High-Z High-Z High-Z FLAG3/Timer Expired/Async Memory Select3. Link Port Data (Link Ports 0-1). Link Port Clock (Link Ports 0-1). Link Port Acknowledge (Link Port 0-1). Thermal Diode Anode Thermal Diode Cathode
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Preliminary Technical Data
Table 6. Pin List (Continued)
ADSP-21462W/ADSP-21465W/ADSP-21467
Name TDI TDO TMS TCK
TRST
EMU
CLK_CFG1-0
BOOT_CFG2-0
RESET
XTAL CLKIN
CLKOUT/ RESETOUT/ RUNRSTIN
MLBCLK
MLBDAT
State During and After Type LVTTL SSTL18 Reset Description I (pu) Test Data Input (JTAG). Provides serial data for the boundary scan logic. TDI has a fixed internal pull-up resistor1, 2. High-Z Test Data Output (JTAG). Serial scan output of the boundary scan path. O /T I (pu) Test Mode Select (JTAG). Used to control the test state machine. TMS has a fixed internal pull-up resistor1, 2. I (pu) Test Clock (JTAG). Provides a clock for JTAG boundary scan. TCK must be asserted (pulsed low) after power-up or held low for proper operation of the device. I (pu) Test Reset (JTAG). Resets the test state machine. TRST must be asserted (pulsed low) after power-up or held low for proper operation of the processor. TRST has a fixed internal pull-up resistor1, 2. O/T (pu) High-Z Emulation Status. Must be connected to the ADSP-21462W/ADSP21465W/ADSP-21467 Analog Devices DSP Tools product line of JTAG emulators target board connector only. EMU has a fixed internal pull-up resistor1, 2. I Core to CLKIN Ratio Control. These pins set the start up clock frequency. See Table 9 for a description of the clock configuration modes. Note that the operating frequency can be changed by programming the PLL multiplier and divider in the PMCTL register at any time after the core comes out of reset. I Boot Configuration Select. These pins select the boot mode for the processor. The BOOTCFG pins must be valid before reset is asserted. See Table 8 for a description of the boot modes. I (pu) Processor Reset. Resets the processor to a known state. Upon deassertion, there is a 4096 CLKIN cycle latency for the PLL to lock. After this time, the core begins program execution from the hardware reset vector address. The RESET input must be asserted (low) at power-up. Crystal Oscillator Terminal. Used in conjunction with CLKIN to drive an O external crystal. Local Clock In. Used in conjunction with XTAL. CLKIN is the clock input. It I configures the processors to use either its internal clock generator or an external clock source. Connecting the necessary components to CLKIN and XTAL enables the internal clock generator. Connecting the external clock to CLKIN while leaving XTAL unconnected configures the processors to use the external clock source such as an external clock oscillator. CLKIN may not be halted, changed, or operated below the specified frequency. I/O (pu) Clock Out/Reset Out/Running Reset In. The functionality can be switched between the PLL output clock and reset out by setting Bit 12 of the PMCTL register. The default is reset out. This pin also has a third function as RUNRSTIN which is enabled by setting bit 0 of the RUNRSTCTL register. For more information, see the ADSP-2146x SHARC Processor Hardware Reference. I (pd) High-Z Media Local Bus Clock. This clock is generated by the MLB controller that is synchronized to the MOST network and provides the timing for the entire MLB interface. 49.152 MHz at Fs=48 kHz High-Z Media Local Bus Data. The MLBDAT line is driven by the transmitting MLB I/O (pd) in 3 pin device and is received by all other MLB devices including the MLB controller. mode. Input in 5 pin The MLBDAT line carries the actual data. In 5-pin MLB mode, this pin will be mode. an input only.
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Table 6. Pin List (Continued)
Preliminary Technical Data
Name MLBSIG
MLBDO MLBSO BR6-1 RPBA ID2-0
1 2
State During and After Type LVTTL SSTL18 Reset Description I/O (pd) in 3 pin High-Z Media Local Bus Signal. This is a multiplexed signal which carries the Chanmode. Input in 5 pin nel/Address generated by the MLB Controller, as well as the Command and mode RxStatus bytes from MLB devices. In 5-pin mode, this pin will be input only. High-Z Media Local Bus Data Output (in 5 pin mode). This pin is used only in 5-pin O (pd) MLB mode. This serves as the output data pin in 5-pin mode. High-Z Media Local Bus Signal Output (in 5 pin mode). This pin is used only in 5O (pd) pin MLB mode. This serves as the output signal pin in 5-pin mode. I/O High-Z/ Bus request. Bus request pins for external DDR2 bus arbitration. Driven low Rotating priority bus arbitration. I I Chip ID
Pull-up/pull-down resistor can not be enabled/disabled and the value of the pull-up/pull-down resistor cannot be programmed. Range of fixed pull-up resistor can be between 26k-63k. Range of fixed pull-down resistor can be between 31k-85k.
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Preliminary Technical Data
DATA MODES
ADSP-21462W/ADSP-
The address and data pins of the external memory interface are muxed (using bits in the SYSCTL register) to support the external memory interface data (input/output), the PDAP (input only), and the FLAGS (input/output). Table 7 provides the pin settings. Table 7. Function of Data Pins
DATA PIN MODE 000 001 010 011 100 101 110 111 AMI_ADDR [23:8] AMI_ADDR [23:0] AMI_ADDR [7:0] Reserved Reserved FLAGS/PWM [15-0] Reserved PDAP (DATA + CTRL) Reserved Three-state all pins FLAGS [7-0] FLAGS [15-0] AMI_DATA [7:0] AMI_DATA [7:0]
BOOT MODES
Table 8. Boot Mode Selection
BOOTCFG2-0 000 001 010 011 100 101 Booting Mode SPI Slave Boot SPI Master Boot AMI user boot (for 8-bit Flash boot) Reserved Link Port 0 Boot Reserved
CORE INSTRUCTION RATE TO CLKIN RATIO MODES
For details on processor timing, see Timing Specifications and Figure 3 on Page 21. Table 9. Core Instruction Rate/ CLKIN Ratio Selection
CLKCFG1-0 00 01 11 10 Core to CLKIN Ratio 6:1 32:1 Reserved 16:1
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ADSP-21462W/ADSP-21465W/ADSP-21467
SPECIFICATIONS
OPERATING CONDITIONS
Parameter1 VDD_INT VDD_EXT VDD_DDR2 VREF VIH4 VIL
4 5 3
Preliminary Technical Data
Description Internal (Core) Supply Voltage External (I/O) Supply Voltage DDR2 Controller Supply Voltage DDR2 Reference Voltage High Level Input Voltage @ VDD_EXT = max Low Level Input Voltage @ VDD_EXT = min High Level Input Voltage @ VDD_EXT = max Low Level Input Voltage @ VDD_EXT = min DC Low Level Input Voltage DC High Level Input Voltage AC Low Level Input Voltage AC High Level Input Voltage
Min TBD2 3.14 1.71 0.84 2.0 -0.3 TBD TBD -0.3 VREF + 0.13 VREF + 250
Max TBD2 3.46 1.89 0.96 3.6 0.8 TBD TBD VREF - 0.12 VDD_DDR2 + 0.3 VREF - 250 125
Unit V V V V V V V V V V mV mV
VIH_CLKIN VIL_CLKIN
5
VIL_DDR2 (DC) VIH_DDR2 (DC) VIL_DDR2 (AC) VIH_DDR2 (AC) TJ
1 2
Junction Temperature 208-Lead PBGA @ TAMBIENT 0 C to +70 C 0
C
Specifications subject to change without notice. The expected value is 1.1V and initial customer designs should design with a programmable regulator that can be adjusted from 0.95V to 1.15V +/-50mV 3 Applies to DDR2 signals. 4 Applies to input and bidirectional pins: AMI_ADDR23-0, AMI_DATA7-0, FLAG3-0, DAI_Px, DPI_Px, SPIDS, BOOTCFGx, CLKCFGx, CLKOUT (RUNRSTIN), RESET, TCK, TMS, TDI, TRST. 5 Applies to input pin CLKIN.
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November 2008
Preliminary Technical Data
ELECTRICAL CHARACTERISTICS
Parameter1 VOH2 VOL2 IOH_DDR24 IOL_DDR2
4
ADSP-21462W/ADSP-21465W/ADSP-21467
Description High Level Output Voltage Low Level Output Voltage Output Source DC Current Output Sink DC Current
Test Conditions @ VDD_EXT = min, IOH = -1.0 mA3 @ VDD_EXT = min, IOL = 1.0 mA3 @ VOH_DDR2 (DC) = VDD_DDR2 -0.28 V @ VOL_DDR2 (DC)=0.28 @ @
Min 2.4
Typical
Max
Unit V
0.4 TBD TBD TBD TBD 10 10 TBD 10 10 TBD TBD TBD
V mA mA mA mA A A A A A A mA pF
VOH_DDR2 VOL_DDR2 IIH IIL
5, 6
High Level Input Current Low Level Input Current
@ VDD_EXT = max, VIN = VDD_EXT max @ VDD_EXT = max, VIN = 0 V @ VDD_EXT = max, VIN = 0 V @ VDD_EXT = max, VIN = VDD_EXT max @ VDD_EXT = max, VIN = 0 V
5 6
IILPU
Low Level Input Current Pull-up Three-State Leakage Current Three-State Leakage Current
8 9, 10
IOZH7, 8 IOZL
7
IOZLPU
Three-State Leakage Current Pull-up @ VDD_EXT = max, VIN = 0 V Supply Current (Internal) Input Capacitance TBD TBD
IDD-INTYP CIN11, 12
1 2
Specifications subject to change without notice. Applies to output and bidirectional pins: AMI_ADDR23-0, AMI_DATA7-0, AMI_RD, AMI_WR, FLAG3-0, DAI_Px, DPI_Px, EMU, TDO, CLKOUT. 3 See Output Drive Currents on Page 53 for typical drive current capabilities. 4 Applies to DDR2_ADDR18-0, DDR2_CAS, DDR2_CS3-0, DDR2_DQ1-0, DDR2_DM1-0, DDR2_DQS1-0, DDR2_DATA15-0, DDR2_RAS, DDR2_WE, DDR2_CLK0, DDR2_CLK0, DDR2_CLK1 and, DDR2_CLK1. 5 Applies to input pins: BOOTCFGx, CLKCFGx, TCK, RESET, CLKIN. 6 Applies to input pins with internal pull-ups: TRST, TMS, TDI. 7 Applies to three-statable pins: FLAG3-0. 8 Applies to three-statable pins with pull-ups: DAI_Px, DPI_Px, EMU. 9 Typical internal current data reflects nominal operating conditions. 10 See Engineer-to-Engineer Note "Estimating Power Dissipation for ADSP-2146x SHARC Processors" for further information. 11 Applies to all signal pins. 12 Guaranteed, but not tested.
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ADSP-21462W/ADSP-21465W/ADSP-21467
MAXIMUM POWER DISSIPATION
See Engineer-to-Engineer Note "Estimating Power Dissipation for ADSP-2146x SHARC Processors" for detailed thermal and power information regarding maximum power dissipation. For information on package thermal specifications, see Thermal Characteristics on Page 54.
Preliminary Technical Data
ABSOLUTE MAXIMUM RATINGS
Stresses greater than those listed in Table 10 may cause permanent damage to the device. These are stress ratings only; functional operation of the device at these or any other conditions greater than those indicated in the operational sections of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. Table 10. Absolute Maximum Ratings
Parameter Internal (Core) Supply Voltage (VDD_INT) Analog (PLL) Supply Voltage (VDD_A) External (I/O) Supply Voltage (VDD_EXT) DDR2 Controller Supply Voltage (VDD_DDR2) Input Voltage Output Voltage Swing Load Capacitance Storage Temperature Range Junction Temperature under Bias Rating -0.3 V to +1.32V TBD -0.3 V to +4.6V -0.5 V to +2.7V -0.5 V to +3.8V -0.5 V to VDD_EXT +0.5V 200 pF -65C to +150C 125C
ESD SENSITIVITY
ESD (electrostatic discharge) sensitive device.
Charged devices and circuit boards can discharge without detection. Although this product features patented or proprietary protection circuitry, damage may occur on devices subjected to high energy ESD. Therefore, proper ESD precautions should be taken to avoid performance degradation or loss of functionality.
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November 2008
Preliminary Technical Data
TIMING SPECIFICATIONS
The ADSP-21462W/ADSP-21465W/ADSP-21467's internal clock (a multiple of CLKIN) provides the clock signal for timing internal memory, processor core, and serial ports. During reset, program the ratio between the processor's internal clock frequency and external (CLKIN) clock frequency with the CLKCFG1-0 pins (see Table 9 on Page 17). To determine switching frequencies for the serial ports, divide down the internal clock, using the programmable divider control of each port (DIVx for the serial ports).
ADSP-21462W/ADSP-21465W/ADSP-21467
Figure 3 shows core to CLKIN ratios of 6:1, 16:1, and 32:1 with external oscillator or crystal. Note that more ratios are possible and can be set through software using the power management control register (PMCTL). For more information, see the ADSP-2136x SHARC Processor Programming Reference. The processor's internal clock switches at higher frequencies than the system input clock (CLKIN). To generate the internal clock, the processor uses an internal phase-locked loop (PLL). This PLL-based clocking minimizes the skew between the system clock (CLKIN) signal and the processor's internal clock.
PMCTL
CLK_CFGx/ PMCTL
LINKPORT CLOCK DIVIDER
BYPASS MUX
LCLK
PMCTL
PLL
CLKIN
BYPASS MUX
CLK_CFGx/ PMCTL PLL DIVIDER DDR2 DIVIDER CCLK
BYPASS MUX
PLLI CLKIN CLK DIVIDER
LOOP FILTER
VCO
DDR2_CLK
XTAL BUF PMCTL PLL MULTIPLIER CLK_CFGx/ PMCTL DIVIDE BY 2 PCLK
CLK_CFGx/PMCTL
PCLK CCLK CLK_CFGx/ PMCTL
PMCTL
BYPASS MUX
MLBSYSCLK
PMCTL CLKOUT
PIN MUX
MLB CLOCK DIVIDER
RESET
DELAY OF 4096 CLKIN CYCLES
RESETOUT
BUF
RESETOUT/ CLKOUT
CORERST
Figure 3. Core Clock and System Clock Relationship to CLKIN
Core clock frequency can be calculated as: fCCLK = (2 x PLLM x fINPUT) / (2 x PLLN) Note that in the user application, the PLL multiplier value should be selected in such a way that the VCO frequency falls in between 160 MHz and 800 MHz. The VCO frequency is calculated as follows: fVCO = 2 x PLLM x fINPUT where: fVCO is the VCO frequency PLLM is the multiplier value programmed fINPUT is the input frequency to the PLL in MHz.
fINPUT = CLKIN when the input divider is disabled fINPUT = CLKIN / 2 when the input divider is enabled Note the definitions of various clock periods shown in Table 12 which are a function of CLKIN and the appropriate ratio control shown in Table 11. Table 11. CLKOUT and CCLK Clock Generation Operation
Timing Requirements CLKIN CCLK Description Input Clock Core Clock Calculation 1/tCK 1/tCCLK
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ADSP-21462W/ADSP-21465W/ADSP-21467
Table 12. Clock Periods
Timing Requirements tCK tCCLK tPCLK tSCLK tDDR2_CLK tSPICLK
1
Preliminary Technical Data
Description1 CLKIN Clock Period (Processor) Core Clock Period (Peripheral) Clock Period = 2 x tCCLK Serial Port Clock Period = (tPCLK) x SR DDR2 DRAM Clock Period = (tCCLK) x SDR SPI Clock Period = (tPCLLK) x SPIR
where: SR = serial port-to-core clock ratio (wide range, determined by SPORT CLKDIV bits in DIVx register) SPIR = SPI-to-Core Clock Ratio (wide range, determined by SPIBAUD register setting) SDR=DDR2 DRAM-to-Core Clock Ratio (Values determined by bits 20-18 of the PMCTL register)
Use the exact timing information given. Do not attempt to derive parameters from the addition or subtraction of others. While addition or subtraction would yield meaningful results for an individual device, the values given in this data sheet reflect statistical variations and worst cases. Consequently, it is not meaningful to add parameters to derive longer times. See Figure 41 on Page 53 under Test Conditions for voltage reference levels. Switching Characteristics specify how the processor changes its signals. Circuitry external to the processor must be designed for compatibility with these signal characteristics. Switching characteristics describe what the processor will do in a given circumstance. Use switching characteristics to ensure that any timing requirement of a device connected to the processor (such as memory) is satisfied. Timing Requirements apply to signals that are controlled by circuitry external to the processor, such as the data input for a read operation. Timing requirements guarantee that the processor operates correctly with other devices.
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November 2008
Preliminary Technical Data
Power-Up Sequencing
The timing requirements for processor startup are given in Table 13.
ADSP-21462W/ADSP-21465W/ADSP-21467
Table 13. Power Up Sequencing Timing Requirements (Processor Startup)
Parameter Timing Requirements tRSTVDD RESET Low Before VDD_EXT or VDD_DDR2 On tEVDD-DDR2VDD VDD_EXT on Before VDD_DDR2 tDDR2VDD_IVDD VDD_DDR2 on Before VDD_INT tCLKVDD1 CLKIN Valid After VDD_INT Valid CLKIN Valid Before RESET Deasserted tCLKRST tPLLRST PLL Control Setup Before RESET Deasserted Switching Characteristic tCORERST Core Reset Deasserted After RESET Deasserted
1 2
Min 0 TBD TBD 0 102 203 4096 x tCK + 2 x tCCLK 4, 5
Max
Unit ms ms ms ms ms ms ms
200
Valid VDD_INT assumes that the supply is fully ramped to its 1 volt rail. Voltage ramp rates can vary from microseconds to hundreds of milliseconds depending on the design of the power supply subsystem. Assumes a stable CLKIN signal, after meeting worst-case startup timing of crystal oscillators. Refer to your crystal oscillator manufacturer's datasheet for startup time. Assume a 25 ms maximum oscillator startup time if using the XTAL pin and internal oscillator circuit in conjunction with an external crystal. 3 Based on CLKIN cycles. 4 Applies after the power-up sequence is complete. Subsequent resets require a minimum of four CLKIN cycles for RESET to be held low in order to properly initialize and propagate default states at all I/O pins. 5 The 4096 cycle count depends on tSRST specification in Table 15. If setup time is not met, one additional CLKIN cycle may be added to the core reset time, resulting in 4097 cycles maximum.
tR S T V D D
RESET
V DDEXT
t E V D D -D D R 2V D D
V DD_DDR2
tD D R 2V D D _IVD D
V DDINT
tC L K V D D
CLKIN
tC L K R S T
CLK_CFG 1-0
t PL L R S T
RESETOUT
tC O R E R S T
Figure 4. Power-Up Sequencing
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ADSP-21462W/ADSP-21465W/ADSP-21467
Clock Input
Table 14. Clock Input
400 MHz Max TBD2 TBD2 TBD2 TBD TBD
Preliminary Technical Data
Parameter Timing Requirements tCK CLKIN Period tCKL CLKIN Width Low tCKH CLKIN Width High tCKRF CLKIN Rise/Fall (0.4 V to 2.0 V) tCCLK3 CCLK Period
1 2
Min TBD1 TBD1 TBD1 2.51
Min TBD1 TBD1 TBD1 2.221
450 MHz Max TBD2 TBD2 TBD2 TBD TBD
Unit ns ns ns ns ns
Applies only for CLKCFG1-0 = 00 and default values for PLL control bits in PMCTL. Applies only for CLKCFG1-0 = 01 and default values for PLL control bits in PMCTL. 3 Any changes to PLL control bits in the PMCTL register must meet core clock timing specification tCCLK.
tCK CLKIN tCKH tCKL
Figure 5. Clock Input
Clock Signals
The ADSP-2146x can use an external clock or a crystal. See the CLKIN pin description in Table 6. Programs can configure the processor to use its internal clock generator by connecting the necessary components to CLKIN and XTAL. Figure 6 shows the component connections used for a crystal operating in fundamental mode. Note that the clock rate is achieved using a 28.125 MHz crystal and a PLL multiplier ratio 16:1 (CCLK:CLKIN achieves a clock speed of 450 MHz). To achieve the full core clock rate, programs need to configure the multiplier bits in the PMCTL register. In case of ADSP-21462W and ADSP-21465W, the maximum clock speed of 400 MHz is arrived at by using a 25 MHz crystal with the default multiplier of 16:1.
ADSP-2146X
CLKIN
R1 1M *
XTAL R2 47 *
C1 22pF
Y1 29.125 MHz
C2 22pF
R2 SHOULD BE CHOSEN TO LIMIT CRYSTAL DRIVE POWER. REFER TO CRYSTAL MANUFACTURER'S SPECIFICATIONS *TYPICAL VALUES
Figure 6. 450 MHz Operation (Fundamental Mode Crystal)
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November 2008
Preliminary Technical Data
Reset
Table 15. Reset
Parameter Timing Requirements tWRST1 RESET Pulse Width Low tSRST RESET Setup Before CLKIN Low
1
ADSP-21462W/ADSP-21465W/ADSP-21467
Min TBD TBD
Max TBD TBD
Unit ns ns
Applies after the power-up sequence is complete. At power-up, the processor's internal phase-locked loop requires no more than 100 ms while RESET is low, assuming stable VDD and CLKIN (not including start-up time of external clock oscillator).
CLKIN tWRST RESET tSRST
Figure 7. Reset
Running Reset
The following timing specification applies to CLKOUT/ RESETOUT/RUNRSTIN pin when it is configured as RUNRSTIN. Table 16. Running Reset
Parameter Timing Requirements tWRUNRST Running RESET Pulse Width Low tSRUNRST Running RESET Setup Before CLKIN High Min TBD TBD Max TBD TBD Unit ns ns
CLKIN tWRUNRST RUNRSTIN tSRUNRST
Figure 8. Running Reset
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ADSP-21462W/ADSP-21465W/ADSP-21467
Interrupts
The following timing specification applies to the FLAG0, FLAG1, and FLAG2 pins when they are configured as IRQ0, IRQ1, and IRQ2 interrupts as well as the DAI_P20-1 and DPI_P14-1 pins when they are configured as interrupts. Table 17. Interrupts
Parameter Timing Requirement tIPW IRQx Pulse Width Min TBD
Preliminary Technical Data
Max TBD
Unit ns
DAI_P20-1 DPI_P14-1 FLAG2-0 (IRQ2-0)
tIPW
Figure 9. Interrupts
Core Timer
The following timing specification applies to FLAG3 when it is configured as the core timer (CTIMER). Table 18. Core Timer
Parameter Switching Characteristic tWCTIM CTIMER Pulse Width Min TBD Max TBD Unit ns
FLAG3 (CTIMER)
tWCTIM
Figure 10. Core Timer
Timer PWM_OUT Cycle Timing
The following timing specification applies to Timer0 and Timer1 in PWM_OUT (pulse-width modulation) mode. Timer signals are routed to the DPI_P14-1 pins through the DPI SRU. Therefore, the timing specifications provided below are valid at the DPI_P14-1 pins. Table 19. Timer PWM_OUT Timing
Parameter Switching Characteristic tPWMO Timer Pulse Width Output Min TBD Max TBD Unit ns
DPI_P14-1 (TIMER1-0)
tPWMO
Figure 11. Timer PWM_OUT Timing
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November 2008
Preliminary Technical Data
Timer WDTH_CAP Timing
The following timing specification applies to timer0 and timer1, and in WDTH_CAP (pulse width count and capture) mode. Timer signals are routed to the DPI_P14-1 pins through the SRU. Therefore, the timing specification provided below is valid at the DPI_P14-1 pins. Table 20. Timer Width Capture Timing
Parameter Timing Requirement tPWI Timer Pulse Width Min TBD
ADSP-21462W/ADSP-21465W/ADSP-21467
Max TBD
Unit ns
tPWI DPI_P14-1 (TIMER1-0)
Figure 12. Timer Width Capture Timing
Pin to Pin Direct Routing (DAI and DPI)
For direct pin connections only (for example DAI_PB01_I to DAI_PB02_O). Table 21. DAI Pin to Pin Routing
Parameter Timing Requirement tDPIO Delay DAI/DPI Pin Input Valid to DAI Output Valid Min TBD Max TBD Unit ns
DAI_Pn DPI_Pn
DAI_Pm DPI_Pm
tDPIO
Figure 13. DAI Pin to Pin Direct Routing
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ADSP-21462W/ADSP-21465W/ADSP-21467
Precision Clock Generator (Direct Pin Routing)
This timing is only valid when the SRU is configured such that the precision clock generator (PCG) takes its inputs directly from the DAI pins (via pin buffers) and sends its outputs directly to the DAI pins. For the other cases, where the PCG's Table 22. Precision Clock Generator (Direct Pin Routing)
Preliminary Technical Data
inputs and outputs are not directly routed to/from DAI pins (via pin buffers) there is no timing data available. All timing parameters and switching characteristics apply to external DAI pins (DAI_P01 - DAI_P20).
Parameter Min Max Unit Timing Requirements tPCGIW Input Clock Period TBD TBD ns tSTRIG PCG Trigger Setup Before Falling Edge of PCG Input TBD TBD ns Clock tHTRIG PCG Trigger Hold After Falling Edge of PCG Input TBD TBD ns Clock Switching Characteristics tDPCGIO PCG Output Clock and Frame Sync Active Edge Delay After PCG Input Clock TBD TBD ns tDTRIGCLK PCG Output Clock Delay After PCG Trigger TBD TBD ns tDTRIGFS PCG Frame Sync Delay After PCG Trigger TBD TBD ns tPCGOW1 Output Clock Period TBD TBD ns D = FSxDIV, PH = FSxPHASE. For more information, see the ADSP-2146x SHARC Processor Hardware Reference, "Precision Clock Generators" chapter.
1
Normal mode of operation.
tSTRIG
DAI_Pn DPI_Pn PCG_TRIGx_I
tHTRIG
tPCGIW
DAI_Pm DPI_Pm PCG_EXTx_I (CLKIN)
tDPCGIO
DAI_Py DPI_Py PCG_CLKx_O
tDTRIGCLK
tDPCGIO
tPCGOW
DAI_Pz DPI_Pz PCG_FSx_O
tDTRIGFS
Figure 14. Precision Clock Generator (Direct Pin Routing)
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November 2008
Preliminary Technical Data
Flags
The timing specifications provided below apply to AMI_ADDR23-0 and AMI_DATA7-0 when configured as FLAGS. See Table 6 on page 13 for more information on flag use. Table 23. Flags
ADSP-21462W/ADSP-21465W/ADSP-21467
Parameter Min Timing Requirement tFIPW DPI_P14-1, AMI_ADDR23-0, AMI_DATA7-0, FLAG3-0 IN Pulse Width TBD Switching Characteristic DPI_P14-1, AMI_ADDR23-0, AMI_DATA7-0, FLAG3-0 OUT Pulse Width TBD tFOPW
Max TBD TBD
Unit ns ns
DPI_P14-1 (FLAG3-0IN) (AMI_DATA7-0) (AMI_ADDR23-0)
tFIPW
DPI_P14-1 (FLAG3-0OUT) (AMI_DATA7-0) AMI_ADDR23-0)
tFOPW
Figure 15. Flags
Rev. PrA |
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ADSP-21462W/ADSP-21465W/ADSP-21467
DDR2 SDRAM Read Cycle Timing
Table 24. DDR2 SDRAM Read Cycle Timing, VDD-DDR2 nominal 1.8V
Parameter Timing Requirements TBD Symbol TBD
Preliminary Technical Data
Minimum TBD
Maximum TBD
Unit TBD
TBD
Figure 16. DDR2 SDRAM Controller Input AC Timing
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November 2008
Preliminary Technical Data
DDR2 SDRAM Write Cycle Timing
ADSP-21462W/ADSP-21465W/ADSP-21467
Table 25. DDR2 SDRAM Write Cycle Timing, VDD-DDR2 nominal 1.8V
Parameter Switching Characteristics TBD Symbol TBD Minimum TBD Maximum TBD Unit TBD
TBD
Figure 17. DDR2 SDRAM Controller Output AC Timing
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ADSP-21462W/ADSP-21465W/ADSP-21467
Memory Read--Bus Master
Use these specifications for asynchronous interfacing to memories. Note that timing for AMI_ACK, AMI_DATA, AMI_RD, AMI_WR, and strobe timing parameters only apply to asynchronous access mode. Table 26. Memory Read--Bus Master
Parameter Min Timing Requirements tDAD Address, Selects Delay to Data Valid1, 2 TBD tDRLD AMI_RD Low to Data Valid1 TBD tSDS Data Setup to AMI_RD High TBD tHDRH Data Hold from AMI_RD High3, 4 TBD tDAAK AMI_ACK Delay from Address, Selects2, 5 TBD tDSAK AMI_ACK Delay from AMI_RD Low4 TBD Switching Characteristics TBD tDRHA Address Selects Hold After AMI_RD High TBD tDARL Address Selects to AMI_RD Low2 TBD tRW AMI_RD Pulse Width TBD tRWR AMI_RD High to AMI_WR, AMI_RD, Low TBD W = (number of wait states specified in AMICTLx register) x tDDR2_CLK. HI = RHC + IC (RHC = (number of Read Hold Cycles specified in AMICTLx register) x tDDR2_CLK IC = (number of idle cycles specified in AMICTLx register) x tDDR2_CLK). H = (number of hold cycles specified in AMICTLx register) x tDDR2_CLK.
1 2
Preliminary Technical Data
Max TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD
Unit ns ns ns ns ns ns ns ns ns ns
Data delay/setup: System must meet tDAD, tDRLD, or tSDS. The falling edge of AMI_MSx, is referenced. 3 Note that timing for AMI_ACK, AMI_DATA, AMI_RD, AMI_WR, and strobe timing parameters only apply to asynchronous access mode. 4 Data hold: User must meet tHDRH in asynchronous access mode. See Test Conditions on Page 53 for the calculation of hold times given capacitive and dc loads. 5 AMI_ACK delay/setup: User must meet tDAAK, or tDSAK, for deassertion of AMI_ACK (low). For asynchronous assertion of AMI_ACK (high) user must meet tDAAK or tDSAK.
ADDRESS MSx
RD
tDARL
tDRHA tRW
tDRLD tDAD
DATA
tSDS tHDRH
tDSAK tDAAK
ACK
tRWR
WR
Figure 18. Memory Read--Bus Master
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November 2008
Preliminary Technical Data
Memory Write--Bus Master
Use these specifications for asynchronous interfacing to memories. Note that timing for AMI_ACK, AMI_DATA, AMI_RD, AMI_WR, and strobe timing parameters only apply to asynchronous access mode.
ADSP-21462W/ADSP-21465W/ADSP-21467
Table 27. Memory Write--Bus Master
Parameter Min Max Unit Timing Requirements tDAAK AMI_ACK Delay from Address, Selects1, 2 TBD TBD ns 1, 3 tDSAK AMI_ACK Delay from AMI_WR Low TBD TBD ns Switching Characteristics TBD TBD tDAWH Address, Selects to AMI_WR Deasserted2 TBD TBD ns 2 tDAWL Address, Selects to AMI_WR Low TBD TBD ns tWW AMI_WR Pulse Width TBD TBD ns tDDWH Data Setup Before AMI_WR High TBD TBD ns tDWHA Address Hold After AMI_WR Deasserted TBD TBD ns Data Hold After AMI_WR Deasserted TBD TBD ns tDWHD tDATRWH Data Disable After AMI_WR Deasserted4 TBD TBD ns tWWR AMI_WR High to AMI_WR, AMI_RD Low TBD TBD ns tDDWR Data Disable Before AMI_RD Low TBD TBD ns tWDE AMI_WR Low to Data Enabled TBD TBD ns W = (number of wait states specified in AMICTLx register) x tSDDR2_CLKH = (number of hold cycles specified in AMICTLx register) x tDDR2_CLK
1 2
AMI_ACK delay/setup: System must meet tDAAK, or tDSAK, for deassertion of AMI_ACK (low). For asynchronous assertion of AMI_ACK (high) user must meet tDAAK or tDSAK. The falling edge of AMI_MSx is referenced. 3 Note that timing for AMI_ACK, AMI_DATA, AMI_RD, AMI_WR, and strobe timing parameters only applies to asynchronous access mode. 4 See Test Conditions on Page 53 for calculation of hold times given capacitive and dc loads.
ADDRESS MSx
tDAWH tDAWL
WR
tDWHA tWW
tWWR tWDE tDDWH
DATA
tDATRWH tDDWR
tDSAK tDAAK
ACK
tDWHD
RD
Figure 19. Memory Write--Bus Master
Link Ports
Calculation of link receiver data setup and hold relative to link clock is required to determine the maximum allowable skew
that can be introduced in the transmission path between LDATA and LCLK. Setup skew is the maximum delay that can be introduced in LDATA relative to LCLK, (setup skew = tLCLK-
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ADSP-21462W/ADSP-21465W/ADSP-21467
TWH min- tDLDCH - tSLDCL). Hold skew is the maximum delay that can be introduced in LCLK relative to LDATA, (hold skew = tLCLKTWL min - tHLDCH - tHLDCL). Calculations made directly from speed specifications will result in unrealistically small skew times because they include multiple tester guardbands. The setup and hold skew times shown below are calculated to include only one tester guardband.
Preliminary Technical Data
Setup Skew = TBD ns max Hold Skew = TBD ns max Note that there is a two-cycle effect latency between the link port enable instruction and the DSP enabling the link port.
Table 28. Link Ports - Receive
Parameter Timing Requirements tSLDCL Data Setup Before LCLK Low tHLDCL Data Hold After LCLK Low tLCLKIW LCLK Period tLCLKRWL LCLK Width Low LCLK Width High tLCLKRWH Switching Characteristics tDLALC LACK Low Delay After LCLK High1
1
Min TBD TBD TBD TBD TBD TBD TBD
Max TBD TBD TBD TBD TBD TBD TBD
Unit ns ns ns ns ns ns
LACK goes low with tDLALC relative to rise of LCLK after first byte, but does not go low if the receiver's link buffer is not about to fill.
tLCLKIW tLCLKRWH
LCLK
tLCLKRWL
tSLDCL
LDAT7-0 IN
tHLDCL
tDLALC
LACK (OUT)
Figure 20. Link Ports--Receive
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November 2008
Preliminary Technical Data
Table 29. Link Ports - Transmit
Parameter Timing Requirements tSLACH LACK Setup Before LCLK High LACK Hold After LCLK High tHLACH Switching Characteristics tDLDCH Data Delay After LCLK High tHLDCH Data Hold After LCLK High tLCLKTWL LCLK Width Low tLCLKTWH LCLK Width High tDLACLK LCLK Low Delay After LACK High
ADSP-21462W/ADSP-21465W/ADSP-21467
Min TBD TBD TBD TBD TBD TBD TBD TBD Max TBD TBD TBD TBD TBD TBD TBD TBD Unit ns ns ns ns ns ns ns
tLCLKTWH
LCLK
tLCLKTWL
LAST BYTE TRANSMITTED
FIRST BYTE TRANSMITTED
LCLK INACTIVE (HIGH)
tDLDCH tHLDCH
LDAT7-0 OUT
tSLACH
LACK (IN)
tHLACH
tDLACLK
THE tSLACH REQUIREMENT APPLIES TO THE RISING EDGE OF LCLK ONLY FOR THE FIRST BYTE TRANSMITTED.
Figure 21. Link Ports--Transmit
Rev. PrA |
Page 35 of 60 | November 2008
ADSP-21462W/ADSP-21465W/ADSP-21467
Serial Ports
To determine whether communication is possible between two devices at clock speed n, the following specifications must be confirmed: 1) frame sync delay and frame sync setup and hold, 2) data delay and data setup and hold, and 3) SCLK width. Table 30. Serial Ports--External Clock
Parameter Timing Requirements tSFSE1 FS Setup Before SCLK (Externally Generated FS in either Transmit or Receive Mode) tHFSE1 FS Hold After SCLK (Externally Generated FS in either Transmit or Receive Mode) 1 tSDRE Receive Data Setup Before Receive SCLK tHDRE1 Receive Data Hold After SCLK tSCLKW SCLK Width tSCLK SCLK Period Switching Characteristics tDFSE2 FS Delay After SCLK (Internally Generated FS in either Transmit or Receive Mode) FS Hold After SCLK tHOFSE2 (Internally Generated FS in either Transmit or Receive Mode) tDDTE2 Transmit Data Delay After Transmit SCLK 2 Transmit Data Hold After Transmit SCLK tHDTE
1 2
Preliminary Technical Data
Serial port signals (SCLK, FS, Data Channel A, Data Channel B) are routed to the DAI_P20-1 pins using the SRU. Therefore, the timing specifications provided below are valid at the DAI_P20-1 pins.
Min
Max
Unit
TBD TBD TBD TBD TBD TBD TBD TBD
TBD TBD TBD TBD TBD TBD TBD TBD
ns ns ns ns ns ns
ns ns ns ns
TBD TBD TBD
TBD TBD TBD
Referenced to sample edge. Referenced to drive edge.
Table 31. Serial Ports--Internal Clock
Parameter Timing Requirements tSFSI1 FS Setup Before SCLK (Externally Generated FS in either Transmit or Receive Mode) tHFSI1 FS Hold After SCLK (Externally Generated FS in either Transmit or Receive Mode) tSDRI1 Receive Data Setup Before SCLK 1 tHDRI Receive Data Hold After SCLK Switching Characteristics tDFSI2 FS Delay After SCLK (Internally Generated FS in Transmit Mode) tHOFSI2 FS Hold After SCLK (Internally Generated FS in Transmit Mode) 2 tDFSIR FS Delay After SCLK (Internally Generated FS in Receive Mode) tHOFSIR2 FS Hold After SCLK (Internally Generated FS in Receive Mode) tDDTI2 Transmit Data Delay After SCLK 2 tHDTI Transmit Data Hold After SCLK tSCKLIW Transmit or Receive SCLK Width
1 2
Min
Max
Unit
TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD
TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD
ns ns ns ns ns ns ns ns ns ns ns
Referenced to the sample edge. Referenced to drive edge.
Rev. PrA |
Page 36 of 60 |
November 2008
Preliminary Technical Data
Table 32. Serial Ports--Enable and Three-State
Parameter Switching Characteristics tDDTEN1 Data Enable from External Transmit SCLK tDDTTE1 Data Disable from External Transmit SCLK tDDTIN1 Data Enable from Internal Transmit SCLK
1
ADSP-21462W/ADSP-21465W/ADSP-21467
Min TBD TBD TBD
Max TBD TBD TBD
Unit ns ns ns
Referenced to drive edge.
Table 33. Serial Ports--External Late Frame Sync
Parameter Min Switching Characteristics tDDTLFSE1 Data Delay from Late External Transmit FS or External Receive FS with MCE = 1, MFD = 0 TBD 1 tDDTENFS Data Enable for MCE = 1, MFD = 0 TBD
1
Max
Unit
TBD TBD
ns ns
The tDDTLFSE and tDDTENFS parameters apply to left-justified sample pair as well as DSP serial mode, and MCE = 1, MFD = 0.
EXTERNAL RECEIVE FS WITH MCE = 1, MFD = 0 DRIVE SAMPLE DRIVE
DAI_P20-1 (SCLK)
tSFSE/I
DAI_P20-1 (FS)
tHFSE/I
tDDTENFS
DAI_P20-1 (DATA CHANNEL A/B)
tDDTE/I tHDTE/I 1ST BIT
2ND BIT
tD DTLFSE
LATE EXTERNAL TRANSMIT FS
DAI_P20-1 (SCLK)
DRIVE
SAMPLE
DRIVE
tSFSE/I
DAI_P20-1 (FS)
tHFSE/I
tDDTENFS
DAI_P20-1 (DATA CHANNEL A/B)
tDDTE/I tHDTE/I
1ST BIT 2ND BIT
tDDTLFSE
NOTE: SERIAL PORT SIGNALS (SCLK, FS, DATA CHANNEL A/B) ARE ROUTED TO THE DAI_P20-1 PINS USING THE SRU. THE TIMING SPECIFICATIONS PROVIDED HERE ARE VALID AT THE DAI_P20-1 PINS. THE CHARACTERIZED AC SPORT TIMINGS ARE APPLICABLE WHEN INTERNAL CLOCKS AND FRAMES ARE LOOPED BACK FROM THE PIN, NOT ROUTED DIRECTLY THROUGH SAU.
Figure 22. External Late Frame Sync1
1
This figure reflects changes made to support left-justified sample pair mode.
Rev. PrA |
Page 37 of 60 | November 2008
ADSP-21462W/ADSP-21465W/ADSP-21467
Preliminary Technical Data
DATA RECEIVE--INTERNAL CLOCK DRIVE EDGE SAMPLE EDGE
DATA RECEIVE--EXTERNAL CLOCK DRIVE EDGE SAMPLE EDGE
tSCLKIW
DAI_P20-1 (SCLK) DAI_P20-1 (SCLK)
tSCLKW
tDFSIR tHOFSIR
DAI_P20-1 (FS)
tSFSI
tHFSI
DAI_P20-1 (FS)
tDFSE tHOFSE tSFSE
tHFSE
tSDRI
DAI_P20-1 (DATA CHANNEL A/B)
tHDRI
DAI_P20-1 (DATA CHANNEL A/B)
tSDRE
tHDRE
NOTE: EITHER THE RISING EDGE OR FALLING EDGE OF SCLK (EXTERNAL) OR SCLK (INTERNAL) CAN BE USED AS THE ACTIVE SAMPLING EDGE.
DATA TRANSMIT--INTERNAL CLOCK DRIVE EDGE SAMPLE EDGE
DATA TRANSMIT--EXTERNAL CLOCK DRIVE EDGE SAMPLE EDGE
tSCLKIW
DAI_P20-1 (SCLK) DAI_P20-1 (SCLK)
tSCLKW
tDFSI tHOFSI
DAI_P20-1 (FS)
tDFSE tSFSI tHFSI
DAI_P20-1 (FS)
tHOFSE
tSFSE
tHFSE
tHDTI
DAI_P20-1 (DATA CHANNEL A/B)
tDDTI
DAI_P20-1 (DATA CHANNEL A/B)
tHDTE
tDDTE
NOTE: EITHER THE RISING EDGE OR FALLING EDGE OF SCLK (EXTERNAL) OR SCLK (INTERNAL) CAN BE USED AS THE ACTIVE SAMPLING EDGE.
DRIVE EDGE DAI_P20-1 SCLK (EXT) SCLK
DRIVE EDGE
tDDTEN
DAI_P20-1 (DATA CHANNEL A/B) DRIVE EDGE
tDDTTE
DAI_P20-1 SCLK (INT)
tDDTIN
DAI_P20-1 (DATA CHANNEL A/B)
Figure 23. Serial Ports
Rev. PrA |
Page 38 of 60 |
November 2008
Preliminary Technical Data
Input Data Port (IDP)
The timing requirements for the IDP are given in Table 34. IDP signals (SCLK, FS, and SDATA) are routed to the DAI_P20-1 pins using the SRU. Therefore, the timing specifications provided below are valid at the DAI_P20-1 pins. Table 34. Input Data Port (IDP)
Parameter Timing Requirements tSISFS1 FS Setup Before SCLK Rising Edge 1 tSIHFS FS Hold After SCLK Rising Edge SData Setup Before SCLK Rising Edge tSISD1 tSIHD1 SData Hold After SCLK Rising Edge tIDPCLKW Clock Width tIDPCLK Clock Period
1
ADSP-21462W/ADSP-21465W/ADSP-21467
Min TBD TBD TBD TBD TBD TBD
Max TBD TBD TBD TBD TBD TBD
Unit ns ns ns ns ns ns
AMI_DATA, SCLK, FS can come from any of the DAI pins. SCLK and FS can also come via PCG or SPORTs. PCG's input can be either CLKIN or any of the DAI pins.
SAMPLE EDGE tIPDCLK
DAI_P20-1 (SCLK)
tIPDCLKW
tSISFS
DAI_P20-1 (FS)
tSIHFS
tSISD
DAI_P20-1 (SDATA)
tSIHD
Figure 24. IDP Master Timing
Rev. PrA |
Page 39 of 60 | November 2008
ADSP-21462W/ADSP-21465W/ADSP-21467
Sample Rate Converter--Serial Input Port
The ASRC input signals (SCLK, FS, and SDATA) are routed from the DAI_P20-1 pins using the SRU. Therefore, the timing specifications provided in Table 35 are valid at the DAI_P20-1 pins. Table 35. ASRC, Serial Input Port
Parameter Timing Requirements tSRCSFS1 FS Setup Before SCLK Rising Edge 1 tSRCHFS FS Hold After SCLK Rising Edge SDATA Setup Before SCLK Rising Edge tSRCSD1 tSRCHD1 SDATA Hold After SCLK Rising Edge tSRCCLKW Clock Width tSRCCLK Clock Period
1
Preliminary Technical Data
Min TBD TBD TBD TBD TBD TBD
Max TBD TBD TBD TBD TBD TBD
Unit ns ns ns ns ns ns
AMI_DATA, SCLK, FS can come from any of the DAI pins. SCLK and FS can also come via PCG or SPORTs. PCG's input can be either CLKIN or any of the DAI pins.
SAMPLE EDGE tSRCCLK
DAI_P20-1 (SCLK)
tSRCCLKW tSRCSFS tSRCHFS
DAI_P20-1 (FS)
tSRCSD
DAI_P20-1 (SDATA)
tSRCHD
Figure 25. ASRC Serial Input Port Timing
Rev. PrA |
Page 40 of 60 |
November 2008
Preliminary Technical Data
Sample Rate Converter--Serial Output Port
For the serial output port, the frame-sync is an input and it should meet setup and hold times with regard to SCLK on the output port. The serial data output, SDATA, has a hold time Table 36. ASRC, Serial Output Port
Parameter Timing Requirements FS Setup Before SCLK Rising Edge tSRCSFS1 tSRCHFS1 FS Hold After SCLK Rising Edge tSRCCLKW Clock Width tSRCCLK Clock Period Switching Characteristics tSRCTDD1 Transmit Data Delay After SCLK Falling Edge 1 Transmit Data Hold After SCLK Falling Edge tSRCTDH
1
ADSP-21462W/ADSP-21465W/ADSP-21467
and delay specification with regard to SCLK. Note that SCLK rising edge is the sampling edge and the falling edge is the drive edge.
Min TBD TBD TBD TBD TBD TBD TBD
Max TBD TBD TBD TBD TBD TBD TBD
Unit ns ns ns ns ns ns
AMI_DATA, SCLK, and FS can come from any of the DAI pins. SCLK and FS can also come via PCG or SPORTs. PCG's input can be either CLKIN or any of the DAI pins.
SAMPLE EDGE tSRCCLK
DAI_P20-1 (SCLK)
tSRCCLKW
tSRCSFS
DAI_P20-1 (FS)
tSRCHFS
tSRCTDD
DAI_P20-1 (SDATA)
tSRCTDH
Figure 26. ASRC Serial Output Port Timing
Rev. PrA |
Page 41 of 60 | November 2008
ADSP-21462W/ADSP-21465W/ADSP-21467
Parallel Data Acquisition Port (PDAP)
The timing requirements for the PDAP are provided in Table 37. PDAP is the parallel mode operation of Channel 0 of the IDP. For details on the operation of the PDAP, see the PDAP chapter of the ADSP-2146x SHARC Processor Hardware Table 37. Parallel Data Acquisition Port (PDAP)
Parameter Timing Requirements tSPCLKEN1 PDAP_CLKEN Setup Before PDAP_CLK Sample Edge 1 tHPCLKEN PDAP_CLKEN Hold After PDAP_CLK Sample Edge PDAP_DAT Setup Before SCLK PDAP_CLK Sample Edge tPDSD1 tPDHD1 PDAP_DAT Hold After SCLK PDAP_CLK Sample Edge tPDCLKW Clock Width tPDCLK Clock Period Switching Characteristics tPDHLDD Delay of PDAP Strobe After Last PDAP_CLK Capture Edge for a Word PDAP Strobe Pulse Width tPDSTRB
1
Preliminary Technical Data
Reference. Note that the most significant 16 bits of external PDAP data can be provided through the DATA7-0 pins. The remaining four bits can only be sourced through DAI_P4-1. The timing below is valid at the DATA7-0 pins.
Min TBD TBD TBD TBD TBD TBD TBD TBD TBD
Max TBD TBD TBD TBD TBD TBD TBD TBD TBD
Unit ns ns ns ns ns ns ns ns
Source pins of AMI_DATA are DATA7-0 or DAI pins. Source pins for SCLK and FS are: 1) DAI pins, 2) CLKIN through PCG, or 3) DAI pins through PCG.
SAMPLE EDGE
t PDCLK t PDCLKW
DAI_P20-1 (PDAP_CLK)
t SPCLKEN
DAI_P20-1 (PDAP_CLKEN)
t HPCLKEN
t PDSD
DATA
t PDHD
DAI_P20-1 (PDAP_STROBE)
tPDSTRB t PDHLDD
Figure 27. PDAP Timing
Rev. PrA |
Page 42 of 60 |
November 2008
Preliminary Technical Data
Pulse-Width Modulation Generators (PWM)
The following timing specifications apply when the AMI_ADDR23-8 pins are configured as PWM. Table 38. Pulse-Width Modulation (PWM) Timing
Parameter Switching Characteristics tPWMW PWM Output Pulse Width tPWMP PWM Output Period
ADSP-21462W/ADSP-21465W/ADSP-21467
Min TBD TBD
Max TBD TBD
Unit ns ns
tPWMW
PWM OUTPUTS
tPWMP
Figure 28. PWM Timing
Rev. PrA |
Page 43 of 60 | November 2008
ADSP-21462W/ADSP-21465W/ADSP-21467
S/PDIF Transmitter
Serial data input to the S/PDIF transmitter can be formatted as left justified, I2S, or right justified with word widths of 16-, 18-, 20-, or 24-bits. The following sections provide timing for the transmitter. S/PDIF Transmitter-Serial Input Waveforms Figure 29 shows the right-justified mode. LRCLK is high for the left channel and low for the right channel. Data is valid on the rising edge of SCLK. The MSB is delayed 12-bit clock periods (in 20-bit output mode) or 16-bit clock periods (in 16-bit output
Preliminary Technical Data
mode) from an LRCLK transition, so that when there are 64 SCLK periods per LRCLK period, the LSB of the data will be right-justified to the next LRCLK transition.
DAI_P20-1 LRCLK DAI_P20-1 SCLK DAI_P20-1 SDATA
LSB
LEFT CHANNEL
RIGHT CHANNEL
MSB
MS B-1
MSB-2
LSB+2 LSB+1
LSB
MSB
MSB-1
MSB-2
LSB+2
LSB+1
LSB
Figure 29. Right-Justified Mode
Figure 30 shows the default I2S-justified mode. LRCLK is low for the left channel and HI for the right channel. Data is valid on the rising edge of SCLK. The MSB is left-justified to an LRCLK transition but with a single SCLK period delay.
RIGHT CHANNEL DAI_P20-1 LRCLK DAI_P20-1 SCLK DAI_P20-1 SDATA
MSB MSB-1 MS B-2 LSB+2 LSB+1 LSB MSB MS B-1 MSB-2 LSB+2 LSB+1 LSB MSB
LEFT CHANNEL
Figure 30. I2S-Justified Mode
Figure 31 shows the left-justified mode. LRCLK is high for the left channel and LO for the right channel. Data is valid on the rising edge of SCLK. The MSB is left-justified to an LRCLK transition with no MSB delay.
DAI_P20-1 LRCLK DAI_P20-1 SCLK DAI_P20-1 SDATA
MSB MSB-1 MSB-2
LEFT CHANNEL
RIGHT CHANNEL
LS B+2
LSB+1
LSB
MSB
MSB-1
MSB-2
LSB+2
LSB +1
LSB
MSB
MSB+1
Figure 31. Left-Justified Mode
Rev. PrA |
Page 44 of 60 |
November 2008
Preliminary Technical Data
S/PDIF Transmitter Input Data Timing The timing requirements for the S/PDIF transmitter are given in Table 39. Input signals (SCLK, FS, SDATA) are routed to the DAI_P20-1 pins using the SRU. Therefore, the timing specifications provided below are valid at the DAI_P20-1 pins. Table 39. S/PDIF Transmitter Input Data Timing
Parameter Timing Requirements tSISFS1 FS Setup Before SCLK Rising Edge tSIHFS1 FS Hold After SCLK Rising Edge tSISD1 SData Setup Before SCLK Rising Edge tSIHD1 SData Hold After SCLK Rising Edge Transmit Clock Width tSITXCLKW tSITXCLK Transmit Clock Period tSISCLKW Clock Width tSISCLK Clock Period
1
ADSP-21462W/ADSP-21465W/ADSP-21467
Min TBD TBD TBD TBD TBD TBD TBD TBD
Max TBD TBD TBD TBD TBD TBD TBD TBD
Unit ns ns ns ns ns ns ns ns
AMI_DATA, SCLK, FS can come from any of the DAI pins. SCLK and FS can also come via PCG or SPORTs. PCG's input can be either CLKIN or any of the DAI pins.
tSITXCLKW SAMPLE EDGE
DAI_P20-1 (TXCLK)
tSITXCLK
DAI_P20-1 (SCLK)
tSISCLKW
tSISCLK tSISFS
DAI_P20-1 (FS)
tSIHFS
tSISD
DAI_P20-1 (SDATA)
tSIHD
Figure 32. S/PDIF Transmitter Input Timing
Oversampling Clock (TxCLK) Switching Characteristics The S/PDIF transmitter has an oversampling clock. This TxCLK input is divided down to generate the biphase clock. Table 40. Over Sampling Clock (TxCLK) Switching Characteristics
Parameter TxCLK Frequency for TxCLK = 384 x FS TxCLK Frequency for TxCLK = 256 x FS Frame Rate Min TBD TBD TBD Max TBD TBD TBD Unit MHz MHz kHz
Rev. PrA |
Page 45 of 60 | November 2008
ADSP-21462W/ADSP-21465W/ADSP-21467
S/PDIF Receiver
The following section describes timing as it relates to the S/PDIF receiver. Internal Digital PLL Mode In the internal digital phase-locked loop mode the internal PLL (digital PLL) generates the TBD x FS clock. Table 41. S/PDIF Receiver Internal Digital PLL Mode Timing
Parameter Switching Characteristics LRCLK Delay After SCLK tDFSI tHOFSI LRCLK Hold After SCLK tDDTI Transmit Data Delay After SCLK tHDTI Transmit Data Hold After SCLK tSCLKIW1 Transmit SCLK Width
1
Preliminary Technical Data
Min TBD TBD TBD TBD TBD
Max TBD TBD TBD TBD TBD
Unit ns ns ns ns ns
SCLK frequency is TBD x FS where FS = the frequency of LRCLK.
DRIVE EDGE tSCLKIW
DAI_P20-1 (SCLK)
SAMPLE EDGE
tDFSI tHOFSI
DAI_P20-1 (FS)
tHDTI
DAI_P20-1 (DATA CHANNEL A/B)
tDDTI
Figure 33. S/PDIF Receiver Internal Digital PLL Mode Timing
Rev. PrA |
Page 46 of 60 |
November 2008
Preliminary Technical Data
SPI Interface--Master
The ADSP-21462W/ADSP-21465W/ADSP-21467 contains two SPI ports. Both primary and secondary are available through DPI only. The timing provided in Table 42 and Table 43 applies to both.
ADSP-21462W/ADSP-21465W/ADSP-21467
Table 42. SPI Interface Protocol--Master Switching and Timing Specifications
Parameter Timing Requirements tSSPIDM Data Input Valid To SPICLK Edge (Data Input Setup Time) tHSPIDM SPICLK Last Sampling Edge To Data Input Not Valid Switching Characteristics tSPICLKM Serial Clock Cycle tSPICHM Serial Clock High Period tSPICLM Serial Clock Low Period tDDSPIDM SPICLK Edge to Data Out Valid (Data Out Delay Time) tHDSPIDM SPICLK Edge to Data Out Not Valid (Data Out Hold Time) FLAG3-0IN (SPI device select) Low to First SPICLK Edge tSDSCIM tHDSM Last SPICLK Edge to FLAG3-0IN High tSPITDM Sequential Transfer Delay Min TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD Max TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD Unit ns ns ns ns ns ns ns ns ns
FLAG3-0 (OUTPUT)
t S DSCIM
SPICLK (CP = 0) (OUTPUT)
t SPICHM
t SPICLM
t SPI CLKM
t HDSM
t SPIT DM
t SPICL M
SPICLK (CP = 1) (OUTPUT)
t SPICHM
t D DSPIDM
MOSI (OUTPUT) MSB
t HDSPIDM
LSB
t SSPIDM
CPHASE = 1 MISO (INPUT) MSB VALID
t SSPIDM t HSPIDM
LSB VALID
tHS PIDM
t DDSPIDM
MOSI (OUTPUT) CPHASE = 0 MISO (INPUT) MSB
t HDSPIDM
LSB
t SSPIDM
MSB VALID
t HSPIDM
LSB VALID
Figure 34. SPI Master Timing
Rev. PrA |
Page 47 of 60 | November 2008
ADSP-21462W/ADSP-21465W/ADSP-21467
SPI Interface--Slave
Table 43. SPI Interface Protocol--Slave Switching and Timing Specifications
Parameter Timing Requirements tSPICLKS tSPICHS tSPICLS tSDSCO Min TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD
Preliminary Technical Data
Max TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD
Unit ns ns ns ns ns ns ns ns ns ns ns ns ns ns
Serial Clock Cycle Serial Clock High Period Serial Clock Low Period SPIDS Assertion to First SPICLK Edge CPHASE = 0 CPHASE = 1 Last SPICLK Edge to SPIDS Not Asserted, CPHASE = 0 tHDS tSSPIDS Data Input Valid to SPICLK edge (Data Input Set-up Time) tHSPIDS SPICLK Last Sampling Edge to Data Input Not Valid tSDPPW SPIDS Deassertion Pulse Width (CPHASE=0) Switching Characteristics tDSOE SPIDS Assertion to Data Out Active SPIDS Deassertion to Data High Impedance tDSDHI tDDSPIDS SPICLK Edge to Data Out Valid (Data Out Delay Time) tHDSPIDS SPICLK Edge to Data Out Not Valid (Data Out Hold Time) tDSOV SPIDS Assertion to Data Out Valid (CPHAS E = 0)
SPIDS (INPUT)
t S P IC H S
SPICLK (CP = 0) (INPUT)
tSPICLS
tSPICLKS tHDS tSDPPW
tSDSCO
SPICLK (CP = 1) (INPUT)
tSPICLS
tSPICHS
tDSOE
tDDSPIDS tDDSPIDS
MSB LSB
tDSDHI tHDSPIDS
MISO (OUTPUT) CPHASE = 1 MOSI (INPUT)
tHSPIDS tSSPIDS
MSB VALID
tSSPIDS
LSB VALID
tDDSPIDS
MISO (OUTPUT) t DSOV CPHASE = 0 MOSI (INPUT) MSB
tHDSPIDS
tDSDHI
LSB
tSSPIDS
MSB VALID LSB VALID
tHSPIDS
Figure 35. SPI Slave Timing
Rev. PrA |
Page 48 of 60 |
November 2008
Preliminary Technical Data
Universal Asynchronous Receiver-Transmitter (UART) Port--Receive and Transmit Timing
Figure 36 describes UART port receive and transmit operations. The maximum baud rate is PCLK/16 where PCLK = 1/tPCLK. As shown in Figure 36 there is some latency between the generTable 44. UART Port
Parameter Timing Requirement Incoming Data Pulse Width tRXD1 Switching Characteristic tTXD1 Outgoing Data Pulse Width
1
ADSP-21462W/ADSP-21465W/ADSP-21467
ation of internal UART interrupts and the external data operations. These latencies are negligible at the data transmission rates for the UART.
Min TBD TBD TBD
Max TBD TBD TBD
Unit ns ns
UART signals RXD and TXD are routed through DPI P14-1 pins using the SRU.
DPI_P14-1 [RXD] RECEIVE INTERNAL UART RECEIVE INTERRUPT
DATA(5-8) STOP tRXD
UART RECEIVE BIT SET BY DATA STOP; CLEARED BY FIFO READ
START DPI_P14-1 [TXD] TRANSMIT INTERNAL UART TRANSMIT INTERRUPT DATA(5-8) STOP(1-2)
tTXD UART TRANSMIT BIT SET BY PROGRAM; CLEARED BY WRITE TO TRANSMIT
Figure 36. UART Port--Receive and Transmit Timing
Rev. PrA |
Page 49 of 60 | November 2008
ADSP-21462W/ADSP-21465W/ADSP-21467
TWI Controller Timing
Table 45 and Figure 37 provide timing information for the TWI interface. Input Signals (SCL, SDA) are routed to the DPI_P14-1 pins using the SRU. Therefore, the timing specifications provided below are valid at the DPI_P14-1 pins.
Preliminary Technical Data
Table 45. Characteristics of the SDA and SCL Bus Lines for F/S-Mode TWI Bus Devices1
Parameter fSCL tHDSTA tLOW tHIGH tSUSTA tHDDAT tSUDAT tSUSTO tBUF tSP
1
SCL Clock Frequency Hold Time (repeated) Start Condition. After This Period, the First Clock Pulse is Generated. Low Period of the SCL Clock High Period of the SCL Clock Setup Time for a Repeated Start Condition Data Hold Time for TWI-bus Devices Data Setup Time Setup Time for Stop Condition Bus Free Time Between a Stop and Start Condition Pulse Width of Spikes Suppressed By the Input Filter
Standard Mode Min Max TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD n/a
Fast Mode Min TBD TBD TBD TBD TBD TBD TBD TBD TBD
Max TBD
Unit kHz s s s s s ns s s ns
n/a
TBD
All values referred to VIHmin and VILmax levels. For more information, see Electrical Characteristics on page 19.
DPI_P14-1 SDA
tSUDA T tLOW
tHDS TA t SP
tBUF
DPI_P14-1 SCL
tHDS TA
S
tH DDA T
tHIGH
tSUS TA
Sr
t SUSTO
P
S
Figure 37. Fast and Standard Mode Timing on the TWI Bus
Rev. PrA |
Page 50 of 60 |
November 2008
Preliminary Technical Data
JTAG Test Access Port and Emulation
Table 46. JTAG Test Access Port and Emulation
Parameter Timing Requirements tTCK TCK Period tSTAP TDI, TMS Setup Before TCK High tHTAP TDI, TMS Hold After TCK High tSSYS1 System Inputs Setup Before TCK High 1 tHSYS System Inputs Hold After TCK High tTRSTW TRST Pulse Width Switching Characteristics tDTDO TDO Delay from TCK Low 2 tDSYS System Outputs Delay After TCK Low
1 2
ADSP-21462W/ADSP-21465W/ADSP-21467
Min TBD TBD TBD TBD TBD TBD TBD TBD TBD
Max TBD TBD TBD TBD TBD TBD TBD TBD TBD
Unit ns ns ns ns ns ns ns ns
System Inputs = AD15-0, CLKCFG1-0, RESET, BOOTCFG1-0, DAI_Px, and FLAG3-0. System Outputs = DAI_Px, AD15-0, AMI_RD, AMI_WR, FLAG3-0, CLKOUT, and EMU.
tTCK TCK tSTAP TMS TDI tDTDO TDO tSSYS SYSTEM INPUTS tDSYS SYSTEM OUTPUTS tHSYS tHTAP
Figure 38. IEEE 1149.1 JTAG Test Access Port
Rev. PrA |
Page 51 of 60 | November 2008
ADSP-21462W/ADSP-21465W/ADSP-21467
Thermal Diode
TBD
Preliminary Technical Data
Media Local Bus
TBD
Rev. PrA |
Page 52 of 60 |
November 2008
Preliminary Technical Data
OUTPUT DRIVE CURRENTS
Figure 39 shows typical I-V characteristics for the output drivers of the ADSP-21462W/ADSP-21465W/ADSP-21467. The curves represent the current drive capability of the output drivers as a function of output voltage.
ADSP-21462W/ADSP-21465W/ADSP-21467
TESTER PIN ELECTRONICS 50 VLOAD 45 70 ZO = 50 (impedance) TD = 4.04 1.18 ns 0.5pF 2pF 400 T1 DUT OUTPUT
50 4pF
12
10
NOTES: THE WORST CASE TRANSMISSION LINE DELAY IS SHOWN AND CAN BE USED FOR THE OUTPUT TIMING ANALYSIS TO REFELECT THE TRANSMISSION LINE EFFECT AND MUST BE CONSIDERED. THE TRANSMISSION LINE (TD), IS FOR LOAD ONLY AND DOES NOT AFFECT THE DATA SHEET TIMING SPECIFICATIONS. ANALOG DEVICES RECOMMENDS USING THE IBIS MODEL TIMING FOR A GIVEN SYSTEM REQUIREMENT. IF NECESSARY, A SYSTEM MAY INCORPORATE EXTERNAL DRIVERS TO COMPENSATE FOR ANY TIMING DIFFERENCES.
8
6
TBD
4
2
Figure 40. Equivalent Device Loading for AC Measurements (Includes All Fixtures)
0 0 50 100 150 200 250
Figure 39. ADSP-21462W/ADSP-21465W/ADSP-21467 Typical Drive at Junction Temperature
outside the ranges shown for Typical Output Delay vs. Load Capacitance and Typical Output Rise Time (20% to 80%, V = Min) vs. Load Capacitance.
TEST CONDITIONS
The ac signal specifications (timing parameters) appear in Table 15 on Page 25 through Table 46 on Page 51. These include output disable time, output enable time, and capacitive loading. The timing specifications for the SHARC apply for the voltage reference levels in Figure 40. Timing is measured on signals when they cross the 1.5 V level as described in Figure 41. All delays (in nanoseconds) are measured between the point that the first signal reaches 1.5 V and the point that the second signal reaches 1.5 V.
12
10
8
6
TBD
4
2
0 0 50 100 150 200 250
INPUT 1.5V OR OUTPUT
1.5V
Figure 42. Typical Output Rise/Fall Time (20% to 80%, VDD_EXT = Max)
Figure 41. Voltage Reference Levels for AC Measurements
CAPACITIVE LOADING
Output delays and holds are based on standard capacitive loads: 30 pF on all pins (see Figure 40). Figure 44 shows graphically how output delays and holds vary with load capacitance. The graphs of Figure 42, Figure 43, and Figure 44 may not be linear
Rev. PrA |
Page 53 of 60 | November 2008
ADSP-21462W/ADSP-21465W/ADSP-21467
12
Preliminary Technical Data
TJ = junction temperature C TCASE = case temperature (C) measured at the top center of the package
10
JT = junction-to-top (of package) characterization parameter
is the Typical value from Table 47. PD = power dissipation
8
6
TBD
Values of JA are provided for package comparison and PCB design considerations. JA can be used for a first order approximation of TJ by the equation: T J = T A + ( JA x P D ) where: TA = ambient temperature C
4
2
0 0 50 100 150 200 250
Figure 43. Typical Output Rise/Fall Time (20% to 80%, VDD_EXT = Min)
Values of JC are provided for package comparison and PCB design considerations when an external heatsink is required. Values of JB are provided for package comparison and PCB design considerations. Note that the thermal characteristics values provided in Table 47 are modeled values. Table 47. Thermal Characteristics for 324-Lead PBGA
Parameter JA JMA JMA JC JT JMT JMT Condition Airflow = 0 m/s Airflow = 1 m/s Airflow = 2 m/s Airflow = 0 m/s Airflow = 1 m/s Airflow = 2 m/s Typical TBD TBD TBD TBD TBD TBD TBD Unit C/W C/W C/W C/W C/W C/W C/W
12
10
8
6
TBD
4
2
0 0 50 100 150 200 250
Figure 44. Typical Output Delay or Hold vs. Load Capacitance (at Ambient Temperature)
THERMAL CHARACTERISTICS
The ADSP-21462W/ADSP-21465W/ADSP-21467 processor is rated for performance over the temperature range specified in Operating Conditions on Page 18. Table 47 airflow measurements comply with JEDEC standards JESD51-2 and JESD51-6 and the junction-to-board measurement complies with JESD51-8. Test board design complies with JEDEC standards JESD51-7 (PBGA). The junction-to-case measurement complies with MIL- STD-883. All measurements use a 2S2P JEDEC test board. To determine the junction temperature of the device while on the application PCB, use: T J = T CASE + ( JT x P D ) where:
Rev. PrA |
Page 54 of 60 |
November 2008
Preliminary Technical Data
BALL CONFIGURATION - ADSP-2146x
Figure 45 shows the ball configuration for the ASDP-2146x.
ADSP-21462W/ADSP-21465W/ADSP-21467
A1 CORNER INDEX AREA
1 A B C D E F G H J K L M N P R T U V
VDDINT VDDEXT VSS NC I/O SIGNALS
D R T A S T A S D D D R D D D D D D D D R D D D D D D
2
3
4
56
78
9 10 11 12 13 14 15 16 17 18
VDD_DDR2 VREF VDD_THD VDD_A VSS_A
Figure 45. ADSP-21462W/ADSP-21465W/ADSP-21467 Ball Configuration - Pin Out
Rev. PrA |
Page 55 of 60 | November 2008
ADSP-21462W/ADSP-21465W/ADSP-21467
PBGA PINOUT
Table 48 lists the pin assignments of the SHARC processors. Table 48. 19 mm by 19 mm PBGA Pin Assignment (Alphabetically by Signal)
Signal AMI_ACK AMI_ADDR0 AMI_ADDR01 AMI_ADDR02 AMI_ADDR03 AMI_ADDR04 AMI_ADDR05 AMI_ADDR06 AMI_ADDR07 AMI_ADDR08 AMI_ADDR09 AMI_ADDR10 AMI_ADDR11 AMI_ADDR12 AMI_ADDR13 AMI_ADDR14 AMI_ADDR15 AMI_ADDR16 AMI_ADDR17 AMI_ADDR18 AMI_ADDR19 AMI_ADDR20 AMI_ADDR21 AMI_ADDR22 AMI_ADDR23 AMI_DATA0 AMI_DATA1 AMI_DATA2 AMI_DATA3 AMI_DATA4 AMI_DATA5 AMI_DATA6 AMI_DATA7 AMI_MS0 AMI_MS1 AMI_RD AMI_WR BOOT_CFG0 BOOT_CFG1 BOOT_CFG2 BR1 BR2 Ball R10 V16 U16 T16 R16 V15 U15 T15 R15 V14 U14 T14 R14 V13 U13 T13 R13 V12 U12 T12 R12 V11 U11 T11 R11 U18 T18 R18 P18 V17 U17 T17 R17 T10 U10 J4 V10 J2 J3 H3 V8 U8 Signal BR3 BR4 BR5 BR6 CLK_CFG0 CLK_CFG1 CLKIN CLKOUT/RESETOUT /RUNRSTIN DAI_P01 DAI_P02 DAI_P03 DAI_P04 DAI_P05 DAI_P06 DAI_P07 DAI_P08 DAI_P09 DAI_P10 DAI_P11 DAI_P12 DAI_P13 DAI_P14 DAI_P15 DAI_P16 DAI_P17 DAI_P18 DAI_P19 DAI_P20 DDR2_ADDR0 DDR2_ADDR01 DDR2_ADDR02 DDR2_ADDR03 DDR2_ADDR04 DDR2_ADDR05 DDR2_ADDR06 DDR2_ADDR07 DDR2_ADDR08 DDR2_ADDR09 DDR2_ADDR10 DDR2_ADDR11 DDR2_ADDR12 DDR2_ADDR13 Ball T8 V9 U9 T9 G1 G2 L1 M2 R7 V6 U6 T6 R6 V5 U5 T5 R5 V4 U4 T4 R4 V3 U3 T3 R3 V2 U2 T2 D13 C13 D14 C14 B14 A14 D15 C15 B15 A15 D16 C16 B16 A16 Signal DDR2_ADDR14 DDR2_ADDR15 DDR2_BA0 DDR2_BA1 DDR2_BA2 DDR2_CAS DDR2_CKE DDR2_CLK0 DDR2_CLK0 DDR2_CLK1 DDR2_CLK1 DDR2_CS0 DDR2_CS1 DDR2_CS2 DDR2_CS3 DDR2_DATA0 DDR2_DATA01 DDR2_DATA02 DDR2_DATA03 DDR2_DATA04 DDR2_DATA05 DDR2_DATA06 DDR2_DATA07 DDR2_DATA08 DDR2_DATA09 DDR2_DATA10 DDR2_DATA11 DDR2_DATA12 DDR2_DATA13 DDR2_DATA14 DDR2_DATA15 DDR2_DM0 DDR2_DM1 DDR2_DQS0 DDR2_DQS0 DDR2_DQS1 DDR2_DQS1 DDR2_ODT DDR2_RAS DDR2_WE DPI_P01 DPI_P02
Preliminary Technical Data
Ball B17 A17 C18 C17 B18 C7 E1 B7 A7 B13 A13 C1 D1 C2 D2 B2 A2 B3 A3 B5 A5 B6 A6 B8 A8 B9 A9 A11 B11 A12 B12 C3 C11 B4 A4 B10 A10 B1 C9 C10 R2 U1
Signal DPI_P03 DPI_P04 DPI_P05 DPI_P06 DPI_P07 DPI_P08 DPI_P09 DPI_P10 DPI_P11 DPI_P12 DPI_P13 DPI_P14 EMU FLAG0 FLAG1 FLAG2 FLAG3 ID_0 ID_1 ID_2 LACK_0 LACK_1 LCLK_0 LCLK_1 LDAT0_0 LDAT0_1 LDAT0_2 LDAT0_3 LDAT0_4 LDAT0_5 LDAT0_6 LDAT0_7 LDAT1_0 LDAT1_1 LDAT1_2 LDAT1_3 LDAT1_4 LDAT1_5 LDAT1_6 LDAT1_7 MLBCLK MLBDO
Ball T1 R1 P1 P2 P3 P4 N1 N2 N3 N4 M3 M4 K2 R8 V7 U7 T7 G3 G4 G5 K17 P17 J18 N18 E18 F17 F18 G17 G18 H16 H17 J16 K18 L16 L17 L18 M16 M17 N16 P16 K3 L4
Rev. PrA |
Page 56 of 60 |
November 2008
Preliminary Technical Data
Signal MLBSIG MLBSO MLDAT RESET RPBA TCK TDI TDO THD_M THD_P TMS TRST VDD_A VDD_DDR2 VDD_DDR2 VDD_DDR2 VDD_DDR2 VDD_DDR2 VDD_DDR2 VDD_DDR2 VDD_DDR2 VDD_DDR2 VDD_DDR2 VDD_DDR2 VDD_DDR2 VDD_DDR2 VDD_DDR2 VDD_DDR2 VDD_DDR2 VDD_DDR2 VDD_EXT VDD_EXT VDD_EXT VDD_EXT VDD_EXT VDD_EXT VDD_EXT VDD_EXT VDD_EXT VDD_EXT VDD_EXT VDD_EXT VDD_EXT VDD_INT Ball L2 L3 K4 M1 R9 K15 L15 M15 N12 N11 K16 N15 H1 G16 G14 F5 F3 F15 E7 E2 E17 E11 E10 D8 D6 D3 D18 C5 C12 E17 P8 P6 P15 P14 P12 P10 N5 M18 M14 L5 K14 J5 J15 F1 Signal VDD_INT VDD_INT VDD_INT VDD_INT VDD_INT VDD_INT VDD_INT VDD_INT VDD_INT VDD_INT VDD_INT VDD_INT VDD_INT VDD_INT VDD_INT VDD_INT VDD_INT VDD_INT VDD_INT VDD_INT VDD_INT VDD_INT VDD_INT VDD_INT VDD_INT VDD_INT VDD_INT VDD_INT VDD_INT VDD_INT VDD_INT VDD_INT VDD_INT VDD_THD VDD_INT VDD_INT VSS_A VSS VSS VSS VSS VSS VSS VSS Ball N9 N8 N7 N6 N13 M6 M13 L6 L13 K6 K13 J6 J13 H6 H5 H14 H13 G6 G13 F9 F8 F7 F6 F13 F12 F11 F10 E9 E8 E6 E15 E14 D12 N10 N9 N8 H2 A1 A18 C4 C6 C8 D5 D7
ADSP-21462W/ADSP-21465W/ADSP-21467
Signal VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS Ball E3 D10 D17 D9 E5 E12 E13 E16 F2 F4 F14 F16 G7 G8 G9 G10 G11 G12 G15 H4 H7 H8 H9 H10 H11 H12 J1 J7 J8 J9 J10 J11 J12 J14 J17 K5 K7 K8 K9 K10 K11 K12 L7 L8 Signal VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VREF VREF XTAL Ball L12 L10 L11 L9 L14 M5 M7 M8 M9 M10 M11 M12 N14 N17 P5 P7 P9 P11 P13 V1 V18 D4 D11 K1
Table 48. 19 mm by 19 mm PBGA Pin Assignment (Alphabetically by Signal)
Rev. PrA |
Page 57 of 60 | November 2008
ADSP-21462W/ADSP-21465W/ADSP-21467
OUTLINE DIMENSIONS
The ADSP-21462W/ADSP-21465W/ADSP-21467 processors are available in a 19 mm by 19 mm PBGA lead-free package.
Preliminary Technical Data
BALL A1 PAD CORNER
19.20 19.00 SQ 18.80
18 16 14 12 10 8 6 4 2 17 15 13 11 9 7 5 3 1 A B C D E F G H J K L M N P R T U V
BALL A1 PAD CORNER
17.05 16.95 SQ 16.85
17.00 BSC SQ
1.00 BSC
TOP VIEW 2.40 2.28 2.16 DETAIL A
1.00 REF
BOTTOM VIEW
DETAIL A
0.61 NOM
1.22 1.17 1.12
0.50 NOM 0.40 MIN SEATING PLANE
0.70 0.60 0.50 BALL DIAMETER
0.20 COPLANARITY
COMPLIANT TO JEDEC STANDARDS MS-034-BAR-2
Figure 46. 324-Ball Plastic Ball Grid Array [PBGA] (B-324) Dimensions shown in millimeters
Rev. PrA |
Page 58 of 60 |
November 2008
Preliminary Technical Data
AUTOMOTIVE PRODUCTS
The ADSP-21462W and ADSP-21465W are available for automotive applications with controlled manufacturing. Note that these special models may have specifications that differ from the general release models. Table 49. Automotive Products
Model AD21462WBBZ3xx AD21465WBBZ3xx
1
ADSP-21462W/ADSP-21465W/ADSP-21467
The automotive grade products shown in Table 49 are available for use in automotive applications. Contact your local ADI account representative or authorized ADI product distributor for specific product ordering information. Note that all automotive products are RoHS compliant.
On-Chip Temperature Range1 SRAM -40C to +85C -40C to +85C 5M bit 5M bit
ROM 4M bit 4M bit
Package Description
Package Option
324-Ball Plastic Ball Grid Array B-324-2 (PBGA) 324-Ball Plastic Ball Grid Array B-324-2 (PBGA)
Referenced temperature is ambient temperature.
ORDERING GUIDE
Temperature Range1 On-Chip SRAM 0 C to +70 C 5 Mbit
Model ADSP-21467KBZ-ENG2, 3, 4
1 2 3 4
ROM 4 Mbit
Package Description Package Option 324-Ball Plastic Ball Grid Array B-324-2 (PBGA)
Referenced temperature is ambient temperature. Z =Part number subject to change. Z =RoHS Compliant Part Available with a wide variety of audio algorithm combinations sold as part of a chipset and bundled with necessary software. For a complete list, visit our website at www.analog.com/SHARC
Rev. PrA |
Page 59 of 60 | November 2008
ADSP-21462W/ADSP-21465W/ADSP-21467
Preliminary Technical Data
(c)2008 Analog Devices, Inc. All rights reserved. Trademarks and registered trademarks are the property of their respective owners. PR07900-0-11/08(PrA)
Rev. PrA |
Page 60 of 60 |
November 2008


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